A review of metallic materials for latent heat thermal energy storage: Thermophysical properties, applications, and challenges

SC Costa, M Kenisarin - Renewable and Sustainable Energy Reviews, 2022 - Elsevier
Phase change materials provide desirable characteristics for latent heat thermal energy
storage by keeping the high energy density and quasi isothermal working temperature …

[HTML][HTML] Study on the microstructure and wear behavior of Mg-containing Al–12Sn–4Si alloys

D Wang, X Wu, K Gao, S Wen, H Wu, J Qiu… - Journal of Materials …, 2022 - Elsevier
Abstract Al–Sn–Si alloys have been widely used as bearing alloys in automotive engines. In
those alloys, β (Sn) phase serves as the solid lubricant and Si particles are used to improve …

Eutectic Solidification Morphologies in Rapidly Solidified Hypereutectic Sn–Ag Solder Alloy

H Rao, A Mullis, R Cochrane - Metallurgical and Materials Transactions A, 2024 - Springer
The effect of rapid solidification upon hypereutectic Sn–Ag solder alloy has been
investigated using a 6.5 m drop tube. Powder sizes ranging from> 850 to< 38 μ m were …

Effect of microstructure features on the corrosion behavior of the Sn-2.1 wt% Mg solder alloy

C Cruz, T Lima, M Soares, E Freitas, E Fujiwara… - Electronic Materials …, 2020 - Springer
Abstract The Sn–Mg eutectic alloy is a potential replacement for the traditional Sn-38.1 wt%
Pb solder alloy, since lead has been banned because of its risk to human health and the …

The Influence of Interfacial Thermal Conductance on the Tensile Strength of a Sn-Mg Solder Alloy

C Cruz, T Soares, A Barros, A Garcia, N Cheung - Metals, 2023 - mdpi.com
Sn-Mg alloys are potential Pb-free solder options. However, their mechanical strength and
interfacial characteristics with electronic substrates remain barely understood. This study …

Reflow optimization process: thermal stress using numerical analysis and intermetallic spallation in backwards compatibility solder joints

FC Ani, A Jalar, R Ismail, NK Othman… - Arabian Journal for …, 2015 - Springer
This study applies the reflow optimization process to investigate the phenomenon of spalling
in aerospace backward compatibility solder joints when utilized with a Ni substrate …

Sn-Mg lead-free solder alloy: Effect of solidification thermal parameters on microstructural features and microhardness

CB Da Cruz, TS Lima, TA Costa, C Brito… - Materials Research …, 2019 - iopscience.iop.org
In the last decade, several studies have been developed on lead-free alloys as potential
candidates to replace Sn–Pb alloys in soldering processes. Sn–Mg alloys arise as …

Structural, surface and transport properties of Sn–Ag alloys

F Meydaneri Tezel, B SAATÇI, M ARI… - Surface Review and …, 2017 - World Scientific
The structural, surface and transport properties of Sn–Ag alloys were investigated by X-ray
diffraction (XRD), radial heat flow, energy-dispersive X-ray (EDX) analysis, scanning …

CHAPTER III TRIBOLOGICAL, MECHANICAL, AND THERMO-ELECTRICAL PROPERTIES OF Sn-Bi-Cu HYPEREUTECTIC ALLOY

FM TEZEL - Engineering and Architecture Science, 2022 - books.google.com
Lead and the compounds containing lead are regarded as toxic substances because of their
hazardous influences on the environment and humans (Mahmudi et al, 2008; 2009; 2010) …

[PDF][PDF] THE EFFECT OF TEMPERATURE AND Al CONTENT ON THE THERMO-ELECTRICAL, MICROSTRUCTURE AND MECHANICAL PROPERTIES OF Sn-Al …

FM TEZEL, B SAATÇİ - ENGINEERING AND ARCHITECTURE … - researchgate.net
Al-Sn alloys have high corrosion resistance, thermal conductivity*, and abrasion resistance.
They are also environmentally friendly (Pb-free), cheap, economical, and suitable for the …