The 2018 GaN power electronics roadmap

H Amano, Y Baines, E Beam, M Borga… - Journal of Physics D …, 2018 - iopscience.iop.org
Gallium nitride (GaN) is a compound semiconductor that has tremendous potential to
facilitate economic growth in a semiconductor industry that is silicon-based and currently …

“Leaky Dielectric” Model for the Suppression of Dynamic in Carbon-Doped AlGaN/GaN HEMTs

MJ Uren, S Karboyan, I Chatterjee… - … on Electron Devices, 2017 - ieeexplore.ieee.org
GaN-on-Si power switching transistors that use carbon-doped epitaxy are highly vulnerable
to dynamic R ON dispersion, leading to reduced switching efficiency. In this paper, we …

Role of wide bandgap materials in power electronics for smart grids applications

J Ballestín-Fuertes, J Muñoz-Cruzado-Alba… - Electronics, 2021 - mdpi.com
At present, the energy transition is leading to the replacement of large thermal power plants
by distributed renewable generation and the introduction of different assets. Consequently, a …

Status of aluminum oxide gate dielectric technology for insulated-gate GaN-based devices

A Calzolaro, T Mikolajick, A Wachowiak - Materials, 2022 - mdpi.com
Insulated-gate GaN-based transistors can fulfill the emerging demands for the future
generation of highly efficient electronics for high-frequency, high-power and high …

Research progress and development prospects of enhanced GaN HEMTs

L Han, X Tang, Z Wang, W Gong, R Zhai, Z Jia… - Crystals, 2023 - mdpi.com
With the development of energy efficiency technologies such as 5G communication and
electric vehicles, Si-based GaN microelectronics has entered a stage of rapid …

Current-collapse-free operations up to 850 V by GaN-GIT utilizing hole injection from drain

S Kaneko, M Kuroda, M Yanagihara… - 2015 IEEE 27th …, 2015 - ieeexplore.ieee.org
Current collapse at high drain voltage in a GaN-based transistor is successfully suppressed
by the introduction of p-GaN region which is placed beside the drain of a Gate Injection …

[图书][B] Gallium nitride and silicon carbide power devices

BJ Baliga - 2016 - books.google.com
During the last 30 years, significant progress has been made to improve our understanding
of gallium nitride and silicon carbide device structures, resulting in experimental …

Temperature-Dependent Dynamic in GaN-Based MIS-HEMTs: Role of Surface Traps and Buffer Leakage

M Meneghini, P Vanmeerbeek… - IEEE transactions on …, 2015 - ieeexplore.ieee.org
This paper reports an investigation of the trapping mechanisms responsible for the
temperature-dependent dynamic-R ON of GaN-based metal-insulator-semiconductor (MIS) …

Investigation of In Situ SiN as Gate Dielectric and Surface Passivation for GaN MISHEMTs

H Jiang, C Liu, Y Chen, X Lu… - IEEE Transactions on …, 2017 - ieeexplore.ieee.org
In this paper, we present a systematic investigation of metal–organic chemical vapor
deposition-grown in situ SiN as the gate dielectric and surface passivation for AlGaN/GaN …

On the impact of carbon-doping on the dynamic Ron and off-state leakage current of 650V GaN power devices

P Moens, P Vanmeerbeek, A Banerjee… - 2015 IEEE 27th …, 2015 - ieeexplore.ieee.org
A strong positive correlation between dynamic Ron and the ionization of buffer traps by
injection of electrons from the Si substrate is presented. By exploring different Carbon …