Bias temperature instability of mosfets: Physical processes, models, and prediction

JF Zhang, R Gao, M Duan, Z Ji, W Zhang, J Marsland - Electronics, 2022 - mdpi.com
CMOS technology dominates the semiconductor industry, and the reliability of MOSFETs is a
key issue. To optimize chip design, trade-offs between reliability, speed, power …

A unified perspective of RTN and BTI

T Grasser, K Rott, H Reisinger, M Waltl… - 2014 IEEE …, 2014 - ieeexplore.ieee.org
It has recently been suggested that random telegraph noise (RTN) and the bias temperature
instability (BTI) are due to similar defects. Here we thoroughly analyze this hypothesis using …

Statistical characterization of time-dependent variability defects using the maximum current fluctuation

P Saraza-Canflanca, J Martín-Martínez… - … on Electron Devices, 2021 - ieeexplore.ieee.org
This article presents a new methodology to extract, at a given operation condition, the
statistical distribution of the number of active defects that contribute to the observed device …

NBTI-generated defects in nanoscaled devices: Fast characterization methodology and modeling

R Gao, Z Ji, AB Manut, JF Zhang… - … on Electron Devices, 2017 - ieeexplore.ieee.org
Negative bias temperature instability (NBTI)-generated defects (GDs) have been widely
observed and known to play an important role in device's lifetime. However, its …

Key issues and solutions for characterizing hot carrier aging of nanometer scale nMOSFETs

M Duan, JF Zhang, Z Ji, WD Zhang… - … on Electron Devices, 2017 - ieeexplore.ieee.org
Silicon bandgap limits the reduction of operation voltage when downscaling device sizes.
This increases the electrical field within-a-device and hot carrier aging (HCA) is becoming …

On the recoverable and permanent components of NBTI in p-channel power VDMOSFETs

D Danković, I Manić, V Davidović… - … on Device and …, 2016 - ieeexplore.ieee.org
This paper introduces a new experimental approach allowing to investigate the recoverable
and permanent components in commercial p-channel power VDMOSFETs subjected to …

Development of a technique for characterizing bias temperature instability-induced device-to-device variation at SRAM-relevant conditions

M Duan, JF Zhang, Z Ji, WD Zhang… - … on Electron Devices, 2014 - ieeexplore.ieee.org
SRAM is vulnerable to device-to-device variation (DDV), since it uses minimum-sized
devices and requires device matching. In addition to the as-fabricated DDV at time-zero …

Impact of Channel Thickness on the NBTI Behaviors in the Ge-OI pMOSFETs With Al2O3/GeOx Gate Stacks

Y Sun, W Schwarzenbach, S Yuan… - IEEE Journal of the …, 2023 - ieeexplore.ieee.org
The impact of channel thickness on the negative-bias temperature instability (NBTI)
behaviors has been studied for the Germanium-on-Insulator (Ge-OI) pMOSFETs. It is found …

Key issues and techniques for characterizing time-dependent device-to-device variation of SRAM

M Duan, JF Zhang, Z Ji, JG Ma, W Zhang… - 2013 IEEE …, 2013 - ieeexplore.ieee.org
Discreteness of aging-induced charges causes a Time-dependent Device-to-Device
Variation (TDDV) and SRAM is vulnerable to it. This work analyses the shortcomings of …

Trigger-When-Charged: A Technique for Directly Measuring RTN and BTI-Induced Threshold Voltage Fluctuation Under Use-

A Manut, R Gao, JF Zhang, Z Ji… - … on Electron Devices, 2019 - ieeexplore.ieee.org
Low-power circuits are important for many applications, such as Internet of Things. Device
variations and fluctuations are challenging their design. Random telegraph noise (RTN) is …