A deep learning method based on partition modeling for reconstructing temperature field

X Peng, X Li, Z Gong, X Zhao, W Yao - International Journal of Thermal …, 2022 - Elsevier
Physical field reconstruction is highly desirable for the measurement and control of
engineering systems. The reconstruction of the temperature field from limited observation …

Investigation of potting-adhesive-induced thermal stress in MEMS pressure sensor

Y Zhang, B Li, H Li, S Shen, F Li, W Ni, W Cao - Sensors, 2021 - mdpi.com
Thermal stress is one of the main sources of micro-electro-mechanical systems (MEMS)
devices error. The Wheatstone bridge is the sensing structure of a typical piezoresistive …

PEGNN: A physics embedded graph neural network for out-of-distribution temperature field reconstruction

Q Li, X Li, X Chen, W Yao - International Journal of Thermal Sciences, 2025 - Elsevier
Amidst the intricate landscape of microelectronic systems, where accurate state estimation
and health assessment stand as formidable challenges, the reconstruction of temperature …

Towards prognostics and health monitoring: The potential of fault detection by piezoresistive silicon stress sensor

A Palczynska, A Prisacaru, PJ Gromala… - … and Multi-Physics …, 2016 - ieeexplore.ieee.org
A piezoresistive silicon based stress sensor has been demonstrated successfully as an
effective tool to monitor the stresses inside electronic packages during various production …

A deep learning method based on patchwise training for reconstructing temperature field

X Peng, X Li, Z Gong, X Zhao, W Yao - arXiv preprint arXiv:2201.10860, 2022 - arxiv.org
Physical field reconstruction is highly desirable for the measurement and control of
engineering systems. The reconstruction of the temperature field from limited observation …

Failure Detection of Electronic Control Units Using Piezoresistive Stress Sensor

A Prisacaru, A Palczynska, A Theissler… - IEEE Transactions …, 2018 - ieeexplore.ieee.org
Recent advancements in automotive technologies, most notably autonomous driving,
demand electronic systems much more complex than those realized in the past. The …

Advanced mechanical/optical configuration of real-time moire interferometry for thermal deformation analysis of fan-out wafer level package

B Wu, B Han - IEEE Transactions on Components, Packaging …, 2018 - ieeexplore.ieee.org
The mechanical/optical configuration of moiré interferometry for real-time observation of
thermal deformations is advanced to quantify the thermomechanical behavior of fan-out …

Hybrid Approach to Conduct Failure Prognostics of Automotive Electronic Control Unit Using Stress Sensor as In Situ Load Counter

B Wu, DS Kim, B Han, A Palczynska… - IEEE Transactions …, 2018 - ieeexplore.ieee.org
A model/sensor hybrid approach is implemented to conduct failure prognostics of an
automotive electronic control unit (ECU). A 3-D finite-element model simulating a complex …

Measurement of anisotropic coefficients of thermal expansion of SAC305 solder using surface strains of single grain with arbitrary orientation

B Wu, YH Yang, B Han, J Schumacher - Acta Materialia, 2018 - Elsevier
The anisotropic coefficient of thermal expansions (CTEs) of SAC305 grain are measured
using a full-field in-plane displacement measurement technique. Theoretical relationships …

Condition monitoring algorithm for piezoresistive silicon-based stress sensor data obtained from electronic control units

A Prisacaru, A Palczynska, PJ Gromala… - 2017 IEEE 67th …, 2017 - ieeexplore.ieee.org
Recent advancements in automotive technologies, most notably autonomous driving,
demand electronic systems much more complex than realized in the past. The automotive …