Silicon is the most widely used material in numerous fields. Traditional mechanical
machining methods have been unable to meet the higher requirements of processing …

Die singulation, also known as wafer dicing, is reviewed in terms of the brief history, critical
challenges, characterization of singulation quality, different singulation technologies and …

Laser dicing plays a vital role in the production of semiconductor devices. It significantly
affects both the quality and production costs of wafers. The inherent hardness and …

The fabrication of micro-holes in silicon substrates that have a proper taper, higher depth-to-
diameter ratio, and better surface quality has been attracting intense interest for a long time …

This paper focuses on the analysis of local phosphorous laser doping in high-efficiency
solar cells. Those so-called selective emitters are intended to reduce the contact …

Laser tragen immer mehr dazu bei kostengünstige Prozessschritte für die Massenproduktion
von hocheffizienten Solarzellen zu ermöglichen. Eine neuartige Lasertechnologie, das so …

In this paper results for liquid media are presented, which are used the first time as liquid jet
for cutting of silicon with laser chemical processing (LCP). The liquids contain a perfluoro …

In order to make solar energy a viable solution for the energy challenges facing humankind
in the coming years, the cost of solar cells must be reduced. The single sided laser-doped …

针对激光切割Al2O3 陶瓷存在热裂纹, 大量熔渣等问题, 提出了低压水射流激光复合切割陶瓷
技术, 并将这种工艺与普通激光切割进行了对比, 结果表明低压水射流激光复合切割陶瓷可以 …

Nowadays, silicon wafer is employed as substrate material for the fabrication of micro-
electro and micromechanical components. Since silicon is a nominally brittle material …