The majority of microelectromechanical system (MEMS) devices must be combined with
integrated circuits (ICs) for operation in larger electronic systems. While MEMS transducers …

The global energy market is seeing increases in the electricity demand of a couple of
percentage points annually. The photovoltaic (PV) industry is also growing rapidly every …

3D conductive microstructures containing gold are fabricated by simultaneous
photopolymerization and photoreduction via direct laser writing. The photoresist employed …

Light-emitting diodes (LEDs) are considered an ideal substitute for low-efficiency traditional
light sources with broad applications in all scientific disciplines. For the past recent years …

The novel low-temperature Cu/SiO 2 hybrid bonding scheme using cluster-Ag passivation
has been proposed in this study for the heterogeneous integration application. With the …

Although ultrasonic (US) wire bonding has been widely applied in microelectronic
packaging industry for decades, the bonding mechanisms are not yet well understood. This …

This paper presents a new method for wafer-level hermetic packaging of MEMS devices
using a relatively low temperature anodic bonding technique applied to the recently …

Through remote forces, levitating micro-actuators completely eliminate mechanical
attachment between the stationary and moving parts of a micro-actuator, thus providing a …

This paper reports a novel and inherently simple fabrication process, so-called advanced
MEMS (aMEMS) process, that is developed for high-yield and reliable manufacturing of …

Biological electromagnetic fields arise throughout all tissue depths and types, and correlate
with physiological processes and signalling in organs of the body. Most of the methods for …