Antenna-in-package (AiP) technology, in which there is an antenna (or antennas) with a
transceiver die (or dies) in a standard surface-mounted device, represents an important …

We propose a novel package topology integrating multilayer miniaturized antennas. Such a
functional package is suitable for the design of a system-on-chip device, or of system-on …

Electronics packaging evolution involves system, technology, and material considerations.
In this paper, we present a novel three-dimensional (3-D) integration approach for system …

Antenna-in-package (AiP) technology integrates an antenna or antennas with a radio or
radar transceiver die (or dies) into a standard surface-mount package. AiP technology …

The system-on-a-package (SOP) concept is considered as the solution of future
communication modules, where more functionality, better performance, low cost, and more …

This paper presents the circuit model of a microstrip patch antenna on a ceramic land grid
array (CLGA) package for the antenna-chip codesign of a highly integrated radio-frequency …

This communication introduces an innovative distributed integrated antenna (DIA)
architecture for millimeter-wave (mmWave) mobile terminals. The DIA discretizes the …

This paper presents a compact antenna geometry to realize an radio frequency (RF) system
in package (SIP) and discusses an antenna-integrated package for an IEEE 802.11 a …

Future wireless communications systems require better performance, lower cost, and
compact RF front-end footprint. The RF front-end module development and its level of …

This paper presents a low-temperature co-fired ceramic (LTCC) package incorporating an
integrated ultra-wide-band (UWB) antenna, antenna-feeding network, and internal space for …