A Charge Recycling Logic Data Links for Single-and Multiple-Channel I/Os
Wide input-output (IO) chip-to-chip interfaces, such as 3-D chip stacking [through-silicon via
(TSV)], silicon interposer in high-bandwidth memory (HBM), and other 2.5-D chip-to-chip …
(TSV)], silicon interposer in high-bandwidth memory (HBM), and other 2.5-D chip-to-chip …