This work presents a flexible and chipless radiofrequency identification (RFID) memory
sensor for customizable temperature threshold detection wirelessly. The developed memory …

In this work, a fully polyimide-based hybrid integration method is for the first time proposed to
not only enable bendability but also enhance computational functionality by packaging …

The characterization of multiple mechanically flexible passive and active electronic
components, namely on-foil temperature sensor, relative humidity sensor, and ultra-thin …

This paper presents a flexible sensor tag using Chip-Film Patch (CFP) technology. It will
include a temperature sensor and a strain sensor. Communication and energy supply will be …

HySiF concept gains its strength from mixing and matching different flexible electronic
technology directions in a way that optimizes the utilization of its integrated components …

Summary Hybrid Systems-in-Foil (HySiF) is a concept that extends the potential of
conventional More-than-More Systems-in/on-Package (SiPs and SoPs) to the flexible …

Due to the strengthened requirements on material purity and uniformity, single-crystalline
silicon has a limited surface area coverage, which is governed by the maximum available …