Measurement uncertainties of a CMOS-based piezoresistive stress sensor are studied for
low cycle thermal loading applications. After the fundamentals of the sensor are reviewed …

A piezoresistive silicon based stress sensor has been demonstrated successfully as an
effective tool to monitor the stresses inside electronic packages during various production …

Stress dependent properties and modeling of lateral enhancement-mode NMOS FETS on
4H silicon carbide are described in detail for a wide range of bias conditions. NFET stress …

In an era where environmental sustainability and electronic reliability are paramount, this
study provides a critical quantitative analysis of lead-free Sn-Ag-Cu (SAC) solder joints …

It is expected that more and more complex (integrated) automotive electronics will be
adopted in systems. These advanced electronics are critical for passenger safety …

In this study, the chip-package interaction is analyzed by means of stress sensors with
electrical simulation being initially carried out to optimize the stress sensor model. The …

The use of integrated passive components in circuit design and the reliability of this type of
circuits are scarcely covered in literature. The fabrication of high-density passive …

This dissertation presents a new approach to prognostics and health monitoring for
automotive applications using a piezoresistive silicon stress sensor. The stress sensor is a …

Belastungs- und Zuverlässigkeitsanalyse einer Ball-Grid-Array-Bauform Page 1
Dissertation zur Erlangung des Doktorgrades der Technischen Fakultät der Albert-Ludwigs-Universität …

Mechanical strains and stresses are developed during the fabrication, assembly and
packaging of the integrated circuit (IC) chips. Sources include processes such as shallow …