Wide band gap (WBG) semiconductors require packaging with reduced parasitic inductance
and capacitance. To achieve this, new packaging solutions are proposed that increase …

Broadband electromagnetic (EM) modeling increases in importance for virtual prototyping of
advanced power electronics systems (PES), enabling a more accurate prediction of fast …

High-speed PCB design for signal integrity (SI) is about feasible material selection, trace
geometry determination and optimization of discontinuities, where the accurate PCB …

Finite element analysis (FEA) is a commonly used technique to estimate the parasitics of
semiconductor packaging structures such as multi-chip power modules (MCPMs). The shift …

In the perspective of upgrading the SOLEIL synchrotron accelerators, new electromagnet
power supplies utilized for the control of the electron beam trajectory are being studied. For …

Measurement of high-current pulses is crucial in some special applications, eg,
electrodynamic accelerators (EA) and converters. In such cases, the current shunts have …

In this paper, an accurate high-frequency modeling methodology for a permanent magnet
synchronous motor (PMSM) in a vehicular electrical braking system is presented, which is …

In recent years, wide-bandgap devices (WBG) such as silicon carbide (SiC) and gallium
nitride (GaN) transistors have drawn significant research attention in power conversion …

In recent times, scholarly attention on Wide-bandgap (WBG) devices, like silicon carbide
(SiC) and gallium nitride (GaN) transistors, focuses on power conversion for heightened …

In many applications, the device under test (DUT) is embedded into a test setup. Various de-
embedding techniques have been proposed to expose the real electrical behaviors of a …