Rapid Ag/Sn/Ag transient liquid phase bonding for high-temperature power devices packaging by the assistance of ultrasound
H Shao, A Wu, Y Bao, Y Zhao, L Liu, G Zou - Ultrasonics Sonochemistry, 2017 - Elsevier
Rapid transient liquid phase (TLP) bonding process on Ag/Sn/Ag system is achieved in air
by the assistance of ultrasonic, which has great potential to be applied to high-temperature …
by the assistance of ultrasonic, which has great potential to be applied to high-temperature …
Determination of solid–liquid interfacial energy of Ni3Sn2 phase by grain boundary groove method in a temperature gradient
P Peng - Journal of Alloys and Compounds, 2019 - Elsevier
Abstract The Ni 3 Sn 2 phase plays an important role in numerous fields including solder
alloys and lithium storage. However, the precise measurements of many parameters which …
alloys and lithium storage. However, the precise measurements of many parameters which …
Thermal stress assessment for transient liquid-phase bonded Si chips in high-power modules using experimental and numerical methods
A Lis, S Kicin, F Brem, C Leinenbach - Journal of Electronic Materials, 2017 - Springer
The potential of transient liquid-phase (TLP) bonding for chip packaging applications has
been evaluated, focusing on three interlayer arrangements (Ag-Sn-Ag, Ni-Sn-Ni, and Ag-Sn …
been evaluated, focusing on three interlayer arrangements (Ag-Sn-Ag, Ni-Sn-Ni, and Ag-Sn …
Growth kinetic of Ag3Sn intermetallic compound in micro-scale Pb-free solder alloys under a temperature gradient
FY Ouyang, YP Su - Journal of Alloys and Compounds, 2016 - Elsevier
The interfacial reaction of Ag 3 Sn intermetallic compounds (IMCs) in micro-scale
Ag/SnAg/Ag sandwich structure was investigated under a temperature gradient of 168.9° …
Ag/SnAg/Ag sandwich structure was investigated under a temperature gradient of 168.9° …
Improvement of thermomigration resistance in lead-free Sn3. 5Ag alloys by Ag interlayer
A significant improvement of thermomigration (TM) resistance in Pb-free Sn3. 5Ag alloys
was achieved by a Ag interlayer. Ag interlayer was used to form Ag 3 Sn intermetallic …
was achieved by a Ag interlayer. Ag interlayer was used to form Ag 3 Sn intermetallic …
Microstructural analysis and thermal conductivity of the Ag–Bi–Sn alloys
Structural and thermal properties of five Ag–Bi–Sn ternary alloys with tin content ranging
from 12.8 to 75.1 mass% and nearly equal mass contents of silver and bismuth were …
from 12.8 to 75.1 mass% and nearly equal mass contents of silver and bismuth were …
Trace of Ag atoms migration induced by temperature gradient in Cu/Sn-5.0 Ag/Cu solder joints
Y Qiao, D Liu, H Liang, N Zhao - Materials Characterization, 2024 - Elsevier
The growth of interfacial IMC in Cu/Sn/Cu and Cu/Sn-5.0 Ag/Cu micro solder joints and the
trace of Ag atoms migration in Cu/Sn-5.0 Ag/Cu micro solder joint during reflow with and …
trace of Ag atoms migration in Cu/Sn-5.0 Ag/Cu micro solder joint during reflow with and …
Geometrical features and chemical adsorptions of (Ag3Sn) n clusters
Q Liu, M Zhang - Computational and Theoretical Chemistry, 2024 - Elsevier
Abstract The Ag-Sn alloys are famous ancient intermetallics, with the Ag 3 Sn being a crucial
component of the phase diagram. Recently, Ag 3 Sn nanoparticles showcase efficient …
component of the phase diagram. Recently, Ag 3 Sn nanoparticles showcase efficient …
Determination of thermal conductivity and interfacial energy of solid Zn solution in the Zn–Al–Bi eutectic system
The equilibrated grain boundary groove shapes for solid Zn solution (Zn–3.0 at.% Al–0.3
at.% Bi) in equilibrium with the Zn–Al–Bi eutectic liquid (Zn–12.7 at.% Al–1.6 at.% Bi) have …
at.% Bi) in equilibrium with the Zn–Al–Bi eutectic liquid (Zn–12.7 at.% Al–1.6 at.% Bi) have …
Synthesis of Ag3Sn Submicrometer Particles via an Adapted Polyol Process in View of Their Use As Die-Attach Material in Power Modules
P Canaud, R Mahayri, F Schoenstein… - Journal of Electronic …, 2019 - Springer
Abstract Intermetallic Ag 3 Sn was synthesized in the form of submicrometer particles
through an adapted two-step polyol process. The precursor salts were tin (II) chloride (SnCl …
through an adapted two-step polyol process. The precursor salts were tin (II) chloride (SnCl …