A review of three‐dimensional resistive switching cross‐bar array memories from the integration and materials property points of view

JY Seok, SJ Song, JH Yoon, KJ Yoon… - Advanced Functional …, 2014 - Wiley Online Library
Issues in the circuitry, integration, and material properties of the two‐dimensional (2D) and
three‐dimensional (3D) crossbar array (CBA)‐type resistance switching memories are …

Architecture and process integration overview of 3D NAND flash technologies

GH Lee, S Hwang, J Yu, H Kim - Applied Sciences, 2021 - mdpi.com
In the past few decades, NAND flash memory has been one of the most successful
nonvolatile storage technologies, and it is commonly used in electronic devices because of …

Three-dimensional NAND flash architecture design based on single-crystalline stacked array

Y Kim, JG Yun, SH Park, W Kim, JY Seo… - … on Electron Devices, 2011 - ieeexplore.ieee.org
Various critical issues related with 3-D stacked nand Flash memory are examined in this
paper. Our single-crystalline STacked ARray (STAR) has many advantages such as better …

Method of constructing a semiconductor device and structure

Z Or-Bach, DC Sekar, B Cronquist, I Beinglass… - US Patent …, 2012 - Google Patents
2011-12-06 Assigned to MONOLITHIC 3D INC. reassignment MONOLITHIC 3D INC.
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …

Integration methods to fabricate internal spacers for nanowire devices

S Kim, KJ Kuhn, T Ghani, AS Murthy… - US Patent …, 2016 - Google Patents
A nanowire device having a plurality of internal spacers and a method for forming said
internal spacers are disclosed. In an embodiment, a semiconductor device comprises a …

Multilevel semiconductor device and structure with memory

Z Or-Bach, JW Han - US Patent 10,515,981, 2019 - Google Patents
US10515981B2 - Multilevel semiconductor device and structure with memory - Google
Patents US10515981B2 - Multilevel semiconductor device and structure with memory …

Method of forming three dimensional integrated circuit devices using layer transfer technique

Z Or-Bach, D Sekar, B Cronquist, Z Wurman - US Patent 8,642,416, 2014 - Google Patents
US8642416B2 - Method of forming three dimensional integrated circuit devices using layer
transfer technique - Google Patents US8642416B2 - Method of forming three dimensional …

Semiconductor device and structure

Z Or-Bach, B Cronquist, I Beinglass, JL De Jong… - US Patent …, 2013 - Google Patents
US8362482B2 - Semiconductor device and structure - Google Patents US8362482B2 -
Semiconductor device and structure - Google Patents Semiconductor device and structure Info …

Silicon synaptic transistor for hardware-based spiking neural network and neuromorphic system

H Kim, S Hwang, J Park, BG Park - Nanotechnology, 2017 - iopscience.iop.org
Brain-inspired neuromorphic systems have attracted much attention as new computing
paradigms for power-efficient computation. Here, we report a silicon synaptic transistor with …

Semiconductor device and structure

Z Or-Bach, B Cronquist, I Beinglass, JL De Jong… - US Patent …, 2013 - Google Patents
2011-03-25 Assigned to MONOLITHIC 3D INC. reassignment MONOLITHIC 3D INC.
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …