Graph theory within power electronics, developed over a 50-year span, is continually
evolving, necessitating ongoing research endeavors. Facing with the never-been-seen …

In this investigation, the chip-last, redistribution-layer (RDL)–first, fan-out panel-level
packaging (FOPLP) for heterogeneous integration is studied. Emphasis is placed on the …

Electronic components often encounter issues such as performance degradation and
thermal damage due to inherent heat generation during operation. Hence, ensuring their …

Designing power electronics converters for harsh environments is challenging due to the
absence of components' performance under harsh conditions, the frequent transition and …

The safe operation and lifetime of the power module are heavily dependent on the
temperature distribution, making it imperative to optimize the thermal performance of the …

A outlook for power devices is discussed from the perspectives of power device and power
electronics application trends. The driving force of the power device business has changed …

The design of power electronic systems is typically performed based on optimisation
procedures. In this paper, the influence of the temperature dependant on-state resistance on …

By utilizing a digital twin, based on physically-motivated device models and comprehensive
time and frequency domain simulations for parasitic extraction, in this work a gate-loop …

Application of very large-scale integration circuit partitioning techniques toward those of
power electronic systems reduces interconnect parasitics while improving overall power …

Usually electrical engineers are relying on simplified analytical or simulative dimensioning
rules in the design of DC/DC converters and then on repetitive redesign iterations. However …