Recent advances and trends in Cu–Cu hybrid bonding
JH Lau - IEEE Transactions on Components, Packaging and …, 2023 - ieeexplore.ieee.org
In this study, the recent advances and trends in Cu–Cu hybrid bonding will be investigated.
Emphasis is placed on the definition, kinds, advantages and disadvantages, challenges …
Emphasis is placed on the definition, kinds, advantages and disadvantages, challenges …
[图书][B] Chiplet design and heterogeneous integration packaging
JH Lau - 2023 - Springer
There are at least five different chiplet design and heterogeneous integration packaging,
namely (1) chip partition and heterogeneous integration (driven by cost and technology …
namely (1) chip partition and heterogeneous integration (driven by cost and technology …
A Comparative Study and Analysis of Various Interconnects for Very Large-Scale Integration
M Susaritha - ECS Advances, 2023 - iopscience.iop.org
Various interconnects utilised in very large-scale integration in this work. The expanding use
of portable devices has increased the demand for low-power circuit design. Sub-threshold …
of portable devices has increased the demand for low-power circuit design. Sub-threshold …
Cu-Cu Hybrid Bonding
JH Lau - Chiplet Design and Heterogeneous Integration …, 2023 - Springer
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