A method for the laser-based machining of a sheet-like substrate, in order to separate the
substrate into multiple portions, in which the laser beam of a laser for machining the …

The present invention relates to a laser cutting technology for cutting and separating thin
substrates of transparent materials, for example to cutting of display glass compositions …

Methods are provided for laser processing arbitrary shapes of molded 3D thin transparent
brittle parts from substrates with particular interest in substrates formed from strengthened or …

Processes of chamfering and/or beveling an edge of a glass or other substrate of arbitrary
shape using lasers are described herein. Three general methods to produce chamfers on …

Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal
line oriented along the beam propagation direction and directed into the material, the laser …

The present invention relates to a method for producing a contour in a planar substrate and
for separating the contour from the substrate, in particular for producing an internal contour …

BACKGROUND 0002 The cutting of holes and slots in thin substrates of transparent
materials. Such as glass, can be accomplished by focused laser beams that are used to …

A method and system for laser pre-cutting a layered material (31) with a laser beam (14) is
disclosed. The layered material (31) comprises at least one tensile stress layer (TSL), at …

The present disclosure relates to a process for cutting and separating arbitrary shapes of
thin Substrates of transparent materials, particularly tailored composite fusion drawn glass …

(57) ABSTRACT A method of laser processing a material to form a separated part. The
method includes focusing a pulsed laser beam into a laser beam focal line, viewed along …