Epoxy resin as the underfill material were widely used in microelectronic packaging, and the
heat transfer performance has become an important factor affecting IC integration …

This paper provides a comprehensive review on copper (Cu) wire bonding. Firstly, it
introduces the common types of Cu wire available in the market, including bare Cu wire …

A novel bi-piezoelectric jet dispenser with a zoom mechanism is proposed to distribute
adhesives rapidly. The work frequency of the new jet dispenser can reach 500 Hz. The …

In this paper, the thermal-mechanical reliability of flip chip on board (FCOB) with copper
pillar solder joint is investigated. By increasing the temperature and time of the thermal …

A comparative study on the difference in interfacial behavior of thermally aged Cu wire
bonding with Al and Au pads was conducted using transmission electron microscopy …

This study conducts stress-controlled cyclic tension-tension tests from room temperature
(RT) to 200° C, at 50° C intervals, on high-purity Cu films to comprehensively understand the …

Reverse engineering techniques of Cu wire bonding process used in manufacturing
microelectronic packing components are proposed for evaluating Cu-Al intermetallic …

This study explores the Cu wire corrosion-related issues and provides solutions for
evaluation & analysis as the Automotive Electronics Council (AEC) continually formulates …

In order to tackle jet motion interference between a needle and guiding part, a new
piezoelectric jet dispenser based on the rhombus magnifying principle is proposed. The new …

In this paper, three Pd-coated Cu (PCC) wires with different Pd-layer thicknesses were used
to make bonding samples, and the influence of Pd-layer thickness on the reliability of …