The escalating demand for high-performance computing is driving the expansion of high-
end packages, leading to increased power requirements. Efficient heat dissipation is crucial …

This paper presents a comparative study that demonstrates the influence of solder joint
shapes on the drop test performance of chip resistors. A 77 by 77 mm 2 test board that …

The construction of accurate constitutive equations is critical for the reliability analysis of the
solder joints in high-density interconnect. However, there are some distinct differences …

Solder joints strongly determine the lifetime of electronic components subjected to
temperature fluctuations. The lifetime predictions obtained by finite element analysis (FEA) …

Related to microelectronics' reliability, lifetime estimation methods have gained importance,
especially for surface-mounted devices. The virtual testing of electronic assemblies …

In the lifetime prediction simulations of microelectronics solder joints, the stand-off height
and misalignment parameters are founded on a variety of estimation methods from very …

The solder joint finite element analysis model of the 0201 chip component was established,
by carrying out the shear loading and tensile loading finite element analysis respectively, the …

Thermomechanical fatigue is one of the most common cause of the failure in microelectronic
technology in the solder joints. The lifetime prediction for microelectronic components is a …

Reflow soldering is a technique that temporarily applies solder paste to contact pads of
numerous surface mount components Reflow profiling is an optimization process to …

Three types of radiation detectors usually can be found in the market: gas-filled detectors,
scintillation detectors, and solid-state detectors. The ion-chamber type of gas-filled was …