Double-node-upset aware SRAM bit-cell for aerospace applications

G Prasad, BC Mandi, M Ali - Microelectronics Reliability, 2022 - Elsevier
In aerospace applications, the continuous scaling of CMOS technology makes SRAM cells
more and more susceptible to soft errors. To overcome this issue, a radiation-hardened …

Energy-efficient radiation hardened SRAM cell for low voltage terrestrial applications

G Prasad, BC Mandi, M Ali - Microelectronics Journal, 2022 - Elsevier
The static random access memory (SRAM) cells are essential for aerospace applications in
near sub-threshold voltage, and it has challenges for the implementation of SRAM cells for …

Impact of cell distance and well-contact density on neutron-induced multiple cell upsets

J Furuta, K Kobayashi, H Onodera - IEICE Transactions on …, 2015 - search.ieice.org
We measure neutron-induced Single Event Upsets (SEUs) and Multiple Cell Upsets (MCUs)
on Flip-Flops (FFs) in a 65-nm bulk CMOS process in order to evaluate dependence of …

Simulation of the characteristics of the DICE 28-nm CMOS cells in unsteady states caused by the effect of single nuclear particles

VY Stenin - Russian Microelectronics, 2015 - Springer
Trigger transistors of the DICE CMOS memory cell can be divided into two groups and
spaced topologically; and if the effect of single nuclear particle affects transistors of only one …

Basic memory elements using DICE cells for fault-tolerant 28 nm CMOS RAM

VY Stenin, PV Stepanov - Russian Microelectronics, 2015 - Springer
Abstract A CMOS DICE (Dual Interlocked Storage Cell) cell consists of two transistor groups
whose layout on the crystal increases the cell's stability against the impact of single nuclear …

Upset-resilient RAM on STG DICE memory elements with the spaced transistors into two groups

VY Stenin, YV Katunin, PV Stepanov - Russian Microelectronics, 2016 - Springer
The first experimental test of new DICE memory cells with the transistors spaced into two
groups (Spaced Transistor Groups DICE—STG DICE), composed on a 65-nm CMOS static …

Effects of collected charge and drain area on SE response of SRAMs at the 5-nm FinFET node

NJ Pieper, Y Xiong, DR Ball… - 2023 IEEE …, 2023 - ieeexplore.ieee.org
Single-port (SP) and two-port (TP) SRAM exposure to low-energy protons, alpha particles,
and heavy-ions with varying supply voltages show particle linear energy transfer (LET) …

Сбоеустойчивые ОЗУ на основе STG DICE элементов памяти с разделенными на две группы транзисторами

ВЯ Стенин, ЮВ Катунин, ПВ Степанов - Микроэлектроника, 2016 - elibrary.ru
Первая экспериментальная проверка новых ячеек памяти DICE с разделенными на две
группы транзисторами (Spaced Transistor Groups DICE–STG DICE) в составе 65-нм …

Terrestrial SER characterization for nanoscale technologies: A comparative study

NN Mahatme, B Bhuva, N Gaspard… - 2015 IEEE …, 2015 - ieeexplore.ieee.org
In this work, the efforts of an industry wide consortium to characterize the logic soft error rate
of a multitude of combinational and sequential logic circuits across multiple technologies is …

TCAD моделирование эффектов воздействия одиночных ядерных частиц на ячейки памяти STG DICE

ЮВ Катунин, ВЯ Стенин - Микроэлектроника, 2018 - elibrary.ru
TCAD моделирование воздействий одиночных ядерных частиц на ячейки памяти STG
DICE с транзисторами, разнесенными на две группы (Spaced Transistor Groups DICE) …