Eutectic alloys with two alternating phases in the microstructure are well known for their
excellent mechanical properties as well as superior castability. In this review, we have …

The dendritic growth characteristics within undercooled liquid pure Fe and binary Fe 50 Cu
50 alloy were investigated by glass fluxing and electromagnetic levitation methods. The …

Over the past few years Sn-based solders containing third and fourth elements have
become of great interest to try and improve the consistency of solders during application. In …

Alloys from the Snsingle bondCu systems have superior properties as compared to the
Snsingle bondPb alloys, such as mechanical and corrosion resistance. However, Snsingle …

The roles of growth direction and Si content on the columnar/equiaxed transition and on
dendritic spacings of Al–Cu–Si alloys still remain as an open field to be studied. In the …

Considerable effort is being made to develop lead-free solders for assembling in
environmental-conscious electronics, due to the inherent toxicity of Pb. The search for …

Directional solidification experiments of eutectic Al single bond Fe alloys were carried out
under different high magnetic field gradients. High magnetic field gradient changed the …

Environmental concerns over the toxicity of Pb are resulting in the progressive ban of Pb-
based solders as part of electrical and electronic devices. Sn-Cu alloys are becoming …

The rapid solidification kinetics of undercooled hypoperitectic Fe 59 Ti 41 alloy was
quantitatively investigated by electrostatic levitation (ESL) and electromagnetic levitation …

In order to understand effect of solidification velocity on microstructure evolution and
mechanical properties of high entropy alloys (HEAs), CoCrFeNi HEA samples were …