Thermally conductive polymer nanocomposites are enticing candidates for not only thermal
managements in electronics but also functional components in emerging thermal energy …

Thermal conductive polymer composites attract lots of research due to the continuous
miniaturization and multi-function of electronic equipment. As a common ceramic, Al 2 O 3 …

Heat dissipation efficiency and electromagnetic interference (EMI) shielding performance
are vital to integration, miniaturization, and application of electronic devices. Flexible and …

Lightweight, strong, and energy-absorbing materials are highly sought after in practical
engineering applications. To this end, interpenetrating phase composites (IPC) stand as a …

In the past decade, particle reinforced foams have been intensively studied and applied in
diverse fields owing to their low weight-to-strength ratio, low cost, and tailorable physical …

Thermal interface materials are crucial for addressing the hot issues of a rapid increase in
thermal density in narrow and limited service spaces. Flexible and designable epoxy resin …

Heat dissipation problem is the primary factor restricting the service life of an electronic
component. The thermal conductivity of materials has become a bottleneck that hinders the …

With the development of integrated circuits, the miniaturization and integration of electronic
devices has become a development trend, and the demand for heat dissipation is also …

Constructing three-dimensional thermally conductive networks in polymer matrix is a key
strategy to improve the thermal management performance of electronic packaging materials …

Rapid development of energy, electrical and electronic technologies has put forward higher
requirements for the thermal conductivities of epoxy resins and their composites. However …