The thermomechanical behavior of metallic thin films on stiff substrates is relevant for thin-
film devices, but its mechanisms are not fully understood. In this investigation, the …

The detailed knowledge of the void evolution is helpful to understand and interpret
traditional electromigration (EM) lifetime experiments. As void formation and subsequent …

This work demonstrated a new and promising approach to control via extrusion for three-
dimensional integrated circuits (3DICs). By depositing 50 nm of Ta as a metallic cap, a …

With increasing performance requirements in power electronics, the necessity has emerged
to investigate the thermo-mechanical behavior of thick Cu metallizations (≥ 5 µm). Cu films …

In the last two decades, the reliability of small electronic devices used in automotive or
consumer electronics gained researchers attention. Thus, there is the need to understand …

Ultra high-cycle fatigue at frequencies in the GHz regime leads to a characteristic void and
extrusion formation in patterned metal thin films. Resulting from the microstructural damage …

This work examines the effect of a metallic cap layer in controlling via extrusion and explores
the underlying mechanisms. Ta was deposited as the cap material, which was very effective …

In this study, we report the reduction of via extrusion for Cu through-silicon vias (TSVs)
through the application of a metallic cap layer. The basic idea of this approach is based on …

We have studied the stress evolution in the tungsten film of a particular open TSV
technology during the thermal processing cycle. The film is attached to the via's wall, where …

In this paper pulsed electric current sintering (PECS) is applied for submicron-sized copper
(sm-Cu) based composite-powders aiming to produce MMC's with higher strength and better …