Reducing Bonding Temperature and Energy Consumption in Electronic Packaging Using Flash Electro-Thermal Carbon Fiber Heating Elements
Semiconductor packaging based on an epoxy molding compound (EMC) currently has
several disadvantages including warpage, limited processing area, and variability that all …
several disadvantages including warpage, limited processing area, and variability that all …
Thermal conductivity of polyaniline reinforced epoxy resin
This study introduces the possibility of using polyaniline as a thermally conductive filler in
the manufacturing process of composites using epoxy. Compared to conventional thermally …
the manufacturing process of composites using epoxy. Compared to conventional thermally …
Maximizing filler content and manufacturing highly thermal conductive composite materials through eutectic liquefaction of epoxy resin
We report novel research results demonstrating the production of polymer nanocomposites
with high thermal conductivity. The use of diluents, a conventionally used method to reduce …
with high thermal conductivity. The use of diluents, a conventionally used method to reduce …
On-line cure monitoring of phenol formaldehyde resin using embedded fiber Bragg grating sensor
R Guo, Y Gu, Y Zhou, S Wang, M Li - Materials Today Communications, 2024 - Elsevier
On-line cure monitoring techniques have shown advantages for identifying the stages of
curing and can lead to smart curing process of resin system and its composites. In this study …
curing and can lead to smart curing process of resin system and its composites. In this study …
[引用][C] 유한요소해석을활용한전자패키지휨에서물성산포의영향분석
박수빈， 김두형， 하상렬， 이용석 - 대한기계학회춘추학술대회, 2023 - dbpia.co.kr
Warpage behavior prediction is one of important skill in electronic packages. Currently, the
prediction of warpage behavior is based on average values. In this study, we analyzed how …
prediction of warpage behavior is based on average values. In this study, we analyzed how …