Developments in many modern applications are encountering rapid escalation in heat
dissipation, coupled with a need to decrease the size of thermal management hardware …

Due to its superior electrical and thermal characteristics, silicon carbide power modules will
soon replace silicon modules to be mass-produced and implemented in all-electric and …

The manifold microchannel heat sink (MMCHS) is a promising design for heat dissipation in
high power electronics. However, the configuration of the microchannels in MMCHS is …

Direct ink writing (DIW) provides a new route to produce SiC-based composites with
complex structure. In this study, we additive manufactured short carbon fiber reinforced SiC …

Active liquid cooling technique with great efficiency not only reduces power consumption but
also effectively dissipates high heat flux. In this study, a manifold-microchannel heat sink …

The manifold microchannel (MMC) heat sink has been used for thermal management of high
heat flux electronics. Flow maldistribution among microchannels is one of the major …

The manifold microchannel heat sink (MMCHS) is a promising design for cooling electronic
devices due to its ability to effectively dissipate high heat flux. The structural changes of the …

The significant advance of power electronics in today's market is calling for high-
performance power conversion systems and MEMS devices that can operate reliably in …

Abstracts Micro-structured surfaces have a significant impact on the flow boiling process in
microchannels, but few numerical studies have been carried out due to their complex nature …

The manifold microchannel (MMC) heat sink system has been widely used in high-heat-flux
chip thermal management due to its high surface-to-volume ratio. Two-phase, three …