Piezoresistive sensors are among the earliest micromachined silicon devices. The need for
smaller, less expensive, higher performance sensors helped drive early micromachining …

Although ultrasonic (US) wire bonding has been widely applied in microelectronic
packaging industry for decades, the bonding mechanisms are not yet well understood. This …

Ultrasonic welding process is a rapid manufacturing process used to weld thin layers of
metal at low temperatures and low energy consumption. Experimental results have shown …

In this investigation, the chip-last, redistribution-layer (RDL)–first, fan-out panel-level
packaging (FOPLP) for heterogeneous integration is studied. Emphasis is placed on the …

Ultrasonic (US) wire bonding is a very complex process during which different mechanisms
occur at different locations of the bonding interface. The change of these local mechanisms …

The purpose of the present study is to understand the interfacial deformation between pad
and wire and the effect of the pad thickness, the pad hardness, and the tool shape on the …

A mechanism was proposed to explain the effects of process parameters on bondability in
ultrasonic ball bonding. The bondability was determined by the slip area at the bonding …

Ultrasonic in situ force signals from integrated piezo-resistive microsensors were used
previously to describe the interfacial stick-slip motion as the most important mechanism in …

Ultrasonic Additive Manufacturing (UAM) is a promising additive manufacturing process
used to build complex structures by joining thin metal films. Layers of metal foil are joined by …

Ultrasonic wire bonding is a solid-state joining process, used in the electronics industry to
form electrical connections, eg to connect electrical terminals within semiconductor modules …