The field of plasma etching is reviewed. Plasma etching, a revolutionary extension of the
technique of physical sputtering, was introduced to integrated circuit manufacturing as early …

Capacitively coupled plasmas (CCPs) have been widely used in thin film deposition and
etching in a variety of industries such as those of semi-conductor/microelectronics, flat panel …

Plasma etching of high aspect ratio (HAR) features, typically vias, is a critical step in the
fabrication of high capacity memory. With aspect ratios (ARs) exceeding 50 (and …

This article discusses key elementary surface-reaction processes in state-of-the-art plasma
etching and deposition relevant to nanoelectronic device fabrication and presents a concise …

As aspect ratios of features in microelectronics fabrication increase to beyond 100,
transferring patterns using plasma etching into underlying materials becomes more …

Two fundamentally different types of dual-frequency (DF) capacitively coupled radio
frequency discharges can be used for plasma processing applications to realize separate …

In high aspect ratio (HAR) plasma etching of holes and trenches in dielectrics, sporadic
twisting is often observed. Twisting is the randomly occurring divergence of a hole or trench …

In this review, we discuss the progress of emerging dry processes with atomic precision.
Researchers in the field of plasma processing and surface science have addressed the …

The etching of sub micrometer high-aspect-ratio (HAR) features into dielectric materials in
low pressure radio frequency technological plasmas is limited by the accumulation of …

The surface conductivity influences the etched pattern profiles in the plasma process. In the
dielectric film etching, it is vital to reduce the charging build-up, which bends the trajectory of …