Most solders used in electronic systems have low-melting temperature and hence
experience significant amount of creep deformation throughout their life-cycle because …

The microstructure control and refinement in length scale are pursued in the development of
next generations of Pb-free solder alloys with high reliability in harsh environments. In the …

The creep behavior of Sn-3.0 Ag-0.5 Cu (SAC305), Sn-3.4 Ag-1.0 Cu-3.3 Bi (SAC-Bi), and
Sn-3.4 Ag-4.8 Bi (SnAg-Bi, all wt.%) was studied in constant-stress creep tests from room …

The creep behavior and hardness of Sn-3.5 Ag-0.7 Cu solder were studied using Berkovich
depth-sensing indentation at temperatures of 25° C to 125° C. Assuming a power-law …

In this study, the performance of three microalloyed Sn-Ag-Cu solder interconnection
compositions (Sn-3.1 Ag-0.52 Cu, Sn-3.0 Ag-0.52 Cu-0.24 Bi, and Sn-1.1 Ag-0.52 Cu-0.1 Ni) …

The mechanical behavior of electroplated Sn thin films was investigated using thermal-
expansion induced strain. For stress above a threshold value, the stress relaxation observed …

An extensive study is made to analyze the impact of pure lanthanum on the microstructure
and mechanical properties of Sn-Ag-Cu (SAC) alloys at high temperatures. Different …

Sn-Ag-Cu (SAC) solders are susceptible to appreciable microstructural coarsening during
storage or service. This results in evolution of joint properties over time and thereby …

Sn whiskers are a re-emerging reliability issue for Pb-free manufacturing. Although stress is
considered as the most likely driving force for whisker formation, there is little quantitative …

Tin-based alloys are commonly used in lead-free solder joints in electronic interconnection
applications, where creep can limit joint reliability. In this work, directionally solidified bulk …