Review of recent progress on vertical GaN-based PN diodes

T Pu, U Younis, HC Chiu, K Xu, HC Kuo… - Nanoscale Research …, 2021 - Springer
As a representative wide bandgap semiconductor material, gallium nitride (GaN) has
attracted increasing attention because of its superior material properties (eg, high electron …

Vertical GaN power devices: Device principles and fabrication technologies—Part I

H Fu, K Fu, S Chowdhury, T Palacios… - IEEE Transactions on …, 2021 - ieeexplore.ieee.org
Recent years have witnessed a tremendous development of vertical gallium nitride (GaN)
power devices, a new class of device technology that could be the key enabler for next …

Robust avalanche in 1.7 kV vertical GaN diodes with a single-implant bevel edge termination

M Xiao, Y Wang, R Zhang, Q Song… - IEEE Electron …, 2023 - ieeexplore.ieee.org
This work demonstrates a novel junction termination extension (JTE) with a graded charge
profile for vertical GaN pn diodes. The fabrication of this JTE obviates GaN etch and requires …

Vertical GaN power devices: Device principles and fabrication technologies—Part II

H Fu, K Fu, S Chowdhury, T Palacios… - IEEE Transactions on …, 2021 - ieeexplore.ieee.org
Vertical gallium nitride (GaN) power devices are enabling next-generation power electronic
devices and systems with higher energy efficiency, higher power density, faster switching …

2.8 kV avalanche in vertical GaN PN diode utilizing field plate on hydrogen passivated P-layer

Z Bian, K Zeng, S Chowdhury - IEEE Electron Device Letters, 2022 - ieeexplore.ieee.org
A novel edge termination method resulting in an avalanche-capable 2.8 kV vertical gallium
nitride (GaN) pn diode is reported. A low transition temperature spin-on-glass (SOG) based …

Nitrogen-Implanted Guard Rings for 600-V Quasi-Vertical GaN-on-Si Schottky Barrier Diodes With a BFOM of 0.26 GW/cm2

X Guo, Y Zhong, Y Zhou, S Su, X Chen… - … on Electron Devices, 2021 - ieeexplore.ieee.org
This work demonstrates a novel Nitrogen-implanted (N-implanted) guard ring (GR)
technology for the 600-V quasi-vertical GaN-on-Si Schottky barrier diode (SBD). The GR …

Selective area regrowth and doping for vertical gallium nitride power devices: Materials challenges and recent progress

H Fu, K Fu, C Yang, H Liu, KA Hatch, P Peri… - Materials Today, 2021 - Elsevier
This paper reviews materials challenges and recent progress for selective area regrowth
and doping for vertical gallium nitride (GaN) power devices. The purpose is to realize …

Enhancement-Mode Gate-Recess-Free GaN-Based p-Channel Heterojunction Field-Effect Transistor With Ultra-Low Subthreshold Swing

C Yang, H Fu, P Peri, K Fu, TH Yang… - IEEE Electron …, 2021 - ieeexplore.ieee.org
We report enhancement-mode p-channel heterojunction field-effect transistors (HFETs)
without gate recess on a standard p-GaN/AlGaN/GaN high electron mobility transistor …

Unveiling the influence of selective-area-regrowth interfaces on local electronic properties of GaN pn junctions for efficient power devices

AS Chang, B Li, S Wang, S Frisone, RS Goldman… - Nano Energy, 2022 - Elsevier
We report correlated nanoscale mapping of the structure, composition, and properties of
regrown GaN pn junctions to identify how etching and non-planar regrowth processes limit …

[HTML][HTML] GaN-on-GaN pin diodes with avalanche capability enabled by eliminating surface leakage with hydrogen plasma treatment

K Fu, Z He, C Yang, J Zhou, H Fu, Y Zhao - Applied Physics Letters, 2022 - pubs.aip.org
Traditional mesa terminations require precise angle design to reduce the electric field at the
edge and surface treatment to reduce etch damage. Otherwise, the device usually suffers a …