This paper reviews recent progress and future directions of signal integrity design for high-
speed digital circuits, focusing on four areas: signal propagation on transmission lines …

This paper reviews the fundamentals and latest progress of modeling, analysis, and design
technologies for signal integrity and electromagnetic compatibility on PCB and package in …

Throughout the decades of continuous advances in semiconductor technology, from the
discrete devices of the late 1950s to today's billon-transistor system-on-chip, there have …

The impedance of a power-distribution network (PDN) in three-dimensionally stacked chips
with multiple through-silicon-via (TSV) connections (a 3D TSV IC) was modeled and …

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit
Boards and Packaging presents the electromagnetic modelling and design of three major …

A multilayer organic package with embedded 60-GHz antennas and fully integrated with a
60-GHz phased-array transmitter or receiver chip is demonstrated. The package includes …

Exact and consistent modeling of circularly shaped ports in the power/ground plane analysis
under the assumption of isotropic excitations is addressed in this paper. Novel expressions …

In this paper, the conventional Baum-Liu-Tesche (BLT) equation is modified to achieve S-
parameters as outputs, and full-wave analysis data for partial structures are combined with …

A low-cost, fully-integrated antenna-in-package solution for 60-GHz phased-array system is
demonstrated. Sixteen patch antennas are integrated into a 28 mm× 28 mm ball grid array …

This paper presents a method for fast and comprehensive simulation of signal propagation,
power/ground noise, and radiated emissions by combining the merits of the physics-based …