Wire bonding, one of the methods for electrically connecting a semiconductor chip with a
substrate, involves attaching thin metal wires to pads. It is the oldest electrical connection …

Corrosive failures for wirebonded packages due to halide ions (especially chloride (Cl-)
uniformly distributed in the mold compound matrix are well understood and measures have …

The risk of corrosion poses a challenge to meet the stringent reliability requirements of
microelectronic devices that are used in harsh environments. Microelectronic devices are …

Since the early 1980s, highly accelerated stress tests (HAST) have been used as an industry-
standard method to qualify the correlated moisture-enhanced, and temperature-accelerated …

Copper aluminum interconnects are being used in automotive applications for deployment
underhood, on-engine and on-transmission. Electronics is widely used for enabling safety …

The current practice of landfilling fly ash generated by waste incineration is nonsustainable,
so alternative ways of using this material are needed. Silanization effectively immobilizes the …

Since the early 1980s, the highly accelerated stress test in conjunction with conventional
temperature–humidity–bias testing has been the industry-standard method for interpreting …

Semiconductor chips are packaged in a process that involves creating a path to allow for
signals to be exchanged with the outside world and ultimately achieving a form to protect …

Amorphous composite polymers are widely used as insulators in microelectronics due to
their high dielectric strength, mechanical robustness, and thermal stability. However, organic …

Copper wire bond interconnect has been used widely as the first-level interconnect in
semiconductor packaging industry over gold wire bond interconnect. It has several …