This paper reviews recent progress and future directions of signal integrity design for high-
speed digital circuits, focusing on four areas: signal propagation on transmission lines …

High-performance computing systems are of steadily growing interest to provide new levels
of computational capability for an increasing range of applications. The growing use of and …

This paper presents a 28-Gb/s transceiver in 32-nm SOI CMOS technology for chip-to-chip
communications over high-loss electrical channels such as backplanes. The equalization …

Progress of high‐speed vertical cavity surface emitting lasers (VCSEL) operating around
980 nm is reviewed. A special focus is on their applications for future short‐reach optical …

Optical interconnects have emerged as promising solutions for assisting electrical
interconnects in short‐reach scenarios, where high bandwidth density and energy efficiency …

Analytical models for vias and traces are presented for simulation of multilayer interconnects
at the package and printed circuit board levels. Vias are modeled using an analytical …

We have developed parallel optical interconnect technologies designed to support terabit/s-
class chip-to-chip data transfer through polymer waveguides integrated in printed circuit …

A cascaded S-parameter method is proposed in this paper for signal/power integrity analysis
of multiple vias in a multilayer printed circuit board (PCB). The proposed method enables …

We successfully developed a high-density broadband 16-channel× 25 Gb/s on-package
silicon photonics optical transceiver. The flip chip bonded bridge structure realized high …

Exact and consistent modeling of circularly shaped ports in the power/ground plane analysis
under the assumption of isotropic excitations is addressed in this paper. Novel expressions …