Progress review of electromagnetic compatibility analysis technologies for packages, printed circuit boards, and novel interconnects
The ever-increasing demands of digital computing and wireless communication have been
driving the semiconductor technology to change with each passing day. Modern electronic …
driving the semiconductor technology to change with each passing day. Modern electronic …
Analytical evaluation of via-plate capacitance for multilayer printed circuit boards and packages
The via-plate capacitance for a via transition to a multilayer printed circuit board is evaluated
analytically in terms of higher order parallel-plate modes. The Green's function in a bounded …
analytically in terms of higher order parallel-plate modes. The Green's function in a bounded …
An intrinsic circuit model for multiple vias in an irregular plate pair through rigorous electromagnetic analysis
An irregular plate pair with multiple vias is analyzed by the segmentation method that
divides the plate pair into a plate domain and via domains. In the via domains, all the …
divides the plate pair into a plate domain and via domains. In the via domains, all the …
Signal/power integrity analysis for multilayer printed circuit boards using cascaded S-parameters
A cascaded S-parameter method is proposed in this paper for signal/power integrity analysis
of multiple vias in a multilayer printed circuit board (PCB). The proposed method enables …
of multiple vias in a multilayer printed circuit board (PCB). The proposed method enables …
Mode-decomposition-based equivalent model of high-speed vias up to 100 GHz
Via transitions in high-speed channels critically influence the signal integrity and power
integrity of high-speed systems. In this article, a mode-decomposition-based equivalent …
integrity of high-speed systems. In this article, a mode-decomposition-based equivalent …
Accuracy of physics-based via models for simulation of dense via arrays
S Müller, X Duan, M Kotzev, YJ Zhang… - IEEE Transactions …, 2012 - ieeexplore.ieee.org
This paper studies the accuracy of the physics-based via model, specifically when applied to
dense via arrays. The physics-based model uses Green's functions for cylindrical waves in …
dense via arrays. The physics-based model uses Green's functions for cylindrical waves in …
Signal integrity: Efficient, physics-based via modeling: Return path, impedance, and stub effect control
J Fan, A Hardock, R Rimolo-Donadio… - IEEE …, 2014 - ieeexplore.ieee.org
In this third paper of the series, physics-based models are used to develop insight into
practical aspects of the electrical performance of via interconnects in the frequency range up …
practical aspects of the electrical performance of via interconnects in the frequency range up …
Mitigation of noise coupling in multilayer high-speed PCB: State of the art modeling methodology and EBG technology
TL Wu, J Fan, F de Paulis, CD Wang… - IEICE transactions on …, 2010 - search.ieice.org
Noise coupling on the power distribution networks (PDN) or between PDN and signal traces
is becoming one of the main challenges in designing above GHz high-speed digital circuits …
is becoming one of the main challenges in designing above GHz high-speed digital circuits …
A novel impedance definition of a parallel plate pair for an intrinsic via circuit model
Rigorous analysis of via-plate-pair interactions requires the impedance of a plate pair to be
defined in terms of radial transmission lines on perfect magnetic conductor (PMC) ports. The …
defined in terms of radial transmission lines on perfect magnetic conductor (PMC) ports. The …
Characterization of via structures in multilayer printed circuit boards with an equivalent transmission-line model
S Pan, J Fan - IEEE Transactions on Electromagnetic …, 2012 - ieeexplore.ieee.org
Vias are typical discontinuities for high-speed signal transmission in printed circuit boards
(PCBs). This paper proposes an equivalent multiconductor transmission-line model for via …
(PCBs). This paper proposes an equivalent multiconductor transmission-line model for via …