The ever-increasing demands of digital computing and wireless communication have been
driving the semiconductor technology to change with each passing day. Modern electronic …

The via-plate capacitance for a via transition to a multilayer printed circuit board is evaluated
analytically in terms of higher order parallel-plate modes. The Green's function in a bounded …

An irregular plate pair with multiple vias is analyzed by the segmentation method that
divides the plate pair into a plate domain and via domains. In the via domains, all the …

A cascaded S-parameter method is proposed in this paper for signal/power integrity analysis
of multiple vias in a multilayer printed circuit board (PCB). The proposed method enables …

Via transitions in high-speed channels critically influence the signal integrity and power
integrity of high-speed systems. In this article, a mode-decomposition-based equivalent …

This paper studies the accuracy of the physics-based via model, specifically when applied to
dense via arrays. The physics-based model uses Green's functions for cylindrical waves in …

In this third paper of the series, physics-based models are used to develop insight into
practical aspects of the electrical performance of via interconnects in the frequency range up …

Noise coupling on the power distribution networks (PDN) or between PDN and signal traces
is becoming one of the main challenges in designing above GHz high-speed digital circuits …

Rigorous analysis of via-plate-pair interactions requires the impedance of a plate pair to be
defined in terms of radial transmission lines on perfect magnetic conductor (PMC) ports. The …

Vias are typical discontinuities for high-speed signal transmission in printed circuit boards
(PCBs). This paper proposes an equivalent multiconductor transmission-line model for via …