A chip stack comprising at least two base layers, each of which includes a base substrate
and a first conductive pattern disposed on the base substrate. The chip stack further …

This patent application is a continuation of PCT Interna tional application Serial No.
US96/08107 which was filed on May 24, 1996 and designated the United States. This patent …

4,868,712 9/1989 Woodman. 4,956,694 9/1990 Eide. 5,012,323 4/1991 Farnworth. as the
conductive elements make contact with the FBGA positioned below or above to form a stack …

An integrated circuit chip stack includes a stack of chip packages mounted on a substrate.
Each chip package includes a plastic packaged chip mounted within a central aperture in a …

63 Continuation of application No. 08/602,179, Feb. 15, 1996, abandoned, which is a
continuation-in-part of application No. 08/452,255, May 26, 1995, which is a continuation-in …

(57) ABSTRACT A chip Stack comprising at least two base layers, each of which includes a
base Substrate and a first conductive pattern disposed on the base Substrate. The chip …

Linden 57 ABSTRACT Method and apparatus for forming Solder balls on electronic
components and for forming Solder joints between electronic components is described. A …

An interconnection contact structure assembly including an electronic component having a
surface and a conductive contact carried by the electronic component and accessible at the …

Same external size and a flash memory of the same memory capacity formed thereon.
These memory chips are mounted over the base Substrate with one of them being …

Two memory chips mounted over a base substrate have the same external size and a flash
memory of the same memory capacity formed thereon. These memory chips are mounted …