Panel stacking of BGA devices to form three-dimensional modules
HR Isaak - US Patent 6,404,043, 2002 - Google Patents
A chip stack comprising at least two base layers, each of which includes a base substrate
and a first conductive pattern disposed on the base substrate. The chip stack further …
and a first conductive pattern disposed on the base substrate. The chip stack further …
Fabricating interconnects and tips using sacrificial substrates
IY Khandros, BN Eldridge, GL Mathieu - US Patent 5,994,152, 1999 - Google Patents
This patent application is a continuation of PCT Interna tional application Serial No.
US96/08107 which was filed on May 24, 1996 and designated the United States. This patent …
US96/08107 which was filed on May 24, 1996 and designated the United States. This patent …
Stackable ball grid array package
DJ Corisis, JM Brooks, WL Moden - US Patent 6,072,233, 2000 - Google Patents
4,868,712 9/1989 Woodman. 4,956,694 9/1990 Eide. 5,012,323 4/1991 Farnworth. as the
conductive elements make contact with the FBGA positioned below or above to form a stack …
conductive elements make contact with the FBGA positioned below or above to form a stack …
Chip stack and method of making same
FK Eide, JA Forthun, H Isaak - US Patent 5,612,570, 1997 - Google Patents
An integrated circuit chip stack includes a stack of chip packages mounted on a substrate.
Each chip package includes a plastic packaged chip mounted within a central aperture in a …
Each chip package includes a plastic packaged chip mounted within a central aperture in a …
Chip-scale carrier for semiconductor devices including mounted spring contacts
SC Chang, IY Khandros, WD Smith - US Patent 6,023,103, 2000 - Google Patents
63 Continuation of application No. 08/602,179, Feb. 15, 1996, abandoned, which is a
continuation-in-part of application No. 08/452,255, May 26, 1995, which is a continuation-in …
continuation-in-part of application No. 08/452,255, May 26, 1995, which is a continuation-in …
Panel stacking of BGA devices to form three-dimensional modules
H Isaak - US Patent App. 10/290,994, 2003 - Google Patents
(57) ABSTRACT A chip Stack comprising at least two base layers, each of which includes a
base Substrate and a first conductive pattern disposed on the base Substrate. The chip …
base Substrate and a first conductive pattern disposed on the base Substrate. The chip …
Solder preforms
IITH Dozier, IY Khandros - US Patent 5,820,014, 1998 - Google Patents
Linden 57 ABSTRACT Method and apparatus for forming Solder balls on electronic
components and for forming Solder joints between electronic components is described. A …
components and for forming Solder joints between electronic components is described. A …
Interconnection substrates with resilient contact structures on both sides
IY Khandros, GL Mathieu - US Patent 6,274,823, 2001 - Google Patents
An interconnection contact structure assembly including an electronic component having a
surface and a conductive contact carried by the electronic component and accessible at the …
surface and a conductive contact carried by the electronic component and accessible at the …
Semiconductor device and a method of manufacturing the same
M Masuda, T Usami - US Patent 6,538,331, 2003 - Google Patents
Same external size and a flash memory of the same memory capacity formed thereon.
These memory chips are mounted over the base Substrate with one of them being …
These memory chips are mounted over the base Substrate with one of them being …
Semiconductor device and a method of manufacturing the same
M Masuda, T Usami - US Patent 7,061,105, 2006 - Google Patents
Two memory chips mounted over a base substrate have the same external size and a flash
memory of the same memory capacity formed thereon. These memory chips are mounted …
memory of the same memory capacity formed thereon. These memory chips are mounted …