A review of high-speed GaN power modules: state of the art, challenges, and solutions

AI Emon, AB Mirza, J Kaplun, SS Vala… - IEEE journal of …, 2022 - ieeexplore.ieee.org
Wide bandgap (WBG) devices are a desirable choice for high-density energy conversion
systems. In high-speed hard-switching applications, voltage overshoot across device …

A review of switching oscillations of wide bandgap semiconductor devices

J Chen, X Du, Q Luo, X Zhang, P Sun… - IEEE Transactions on …, 2020 - ieeexplore.ieee.org
Wide bandgap (WBG) devices offer the advantages of high frequency, high efficiency, and
high power density to power converters due to their excellent performance. However, their …

A survey of EMI research in power electronics systems with wide-bandgap semiconductor devices

B Zhang, S Wang - IEEE Journal of Emerging and Selected …, 2019 - ieeexplore.ieee.org
Wide-bandgap (WBG) power semiconductor devices have become increasingly popular due
to their superior characteristics compared to their Si counterparts. However, their fast …

The role of power device technology in the electric vehicle powertrain

E Robles, A Matallana, I Aretxabaleta… - … Journal of Energy …, 2022 - Wiley Online Library
In the automotive industry, the design and implementation of power converters and
especially inverters, are at a turning point. Silicon (Si) IGBTs are at present the most widely …

SiC and GaN devices with cryogenic cooling

R Chen, FF Wang - IEEE Open Journal of Power Electronics, 2021 - ieeexplore.ieee.org
This article presents the cryogenically cooled application for wide bandgap (WBG)
semiconductor devices. Characteristics of silicon carbide (SiC) and gallium nitride (GaN) at …

A survey on switching oscillations in power converters

T Liu, TTY Wong, ZJ Shen - … of Emerging and Selected Topics in …, 2019 - ieeexplore.ieee.org
High-frequency power converters enabled by wide bandgap (WBG) and silicon
semiconductor devices offer distinct advantages in power density and dynamic performance …

A fast-switching integrated full-bridge power module based on GaN eHEMT devices

AB Jørgensen, S Bęczkowski… - … on Power Electronics, 2018 - ieeexplore.ieee.org
New packaging solutions and power module structures are required to fully utilize the
benefits of emerging commercially available wide bandgap semiconductor devices …

A high-bandwidth integrated current measurement for detecting switching current of fast GaN devices

K Wang, X Yang, H Li, L Wang… - IEEE Transactions on …, 2017 - ieeexplore.ieee.org
Gallium nitride (GaN) devices are suitable for high-frequency power converters due to their
excellent switching performance. To maximize the performance of GaN devices, it is …

Layout-dominated dynamic current imbalance in multichip power module: Mechanism modeling and comparative evaluation

Z Zeng, X Zhang, X Li - IEEE Transactions on Power …, 2019 - ieeexplore.ieee.org
The multichip power module is an irreplaceable component for high-capacity industrial
converters. Dynamic current imbalance among parallel chips challenges the electrothermal …

Overview of digital design and finite-element analysis in modern power electronic packaging

AB Jørgensen, S Munk-Nielsen… - IEEE Transactions on …, 2020 - ieeexplore.ieee.org
Wide band gap (WBG) semiconductors require packaging with reduced parasitic inductance
and capacitance. To achieve this, new packaging solutions are proposed that increase …