Review on polymer composites with high thermal conductivity and low dielectric properties for electronic packaging

R Li, X Yang, J Li, Y Shen, L Zhang, R Lu, C Wang… - Materials today …, 2022 - Elsevier
Polymers are widely used in electronic packaging due to their easy processing, lightweight,
excellent insulation, and good mechanical properties. However, as electronic devices …

Factors affecting thermal conductivities of the polymers and polymer composites: A review

Y Guo, K Ruan, X Shi, X Yang, J Gu - Composites Science and Technology, 2020 - Elsevier
It is of considerable scientific and technological importance to enhance the thermal
conductivity coefficient (λ) values of the polymers and polymer composites. Limited …

Thermal transport in polymeric materials and across composite interfaces

N Mehra, L Mu, T Ji, X Yang, J Kong, J Gu, J Zhu - Applied Materials Today, 2018 - Elsevier
Thermal conduction in polymeric materials and across interfaces is of considerable scientific
and technological importance nevertheless only very few studies are available without …

Significantly enhanced and precisely modeled thermal conductivity in polyimide nanocomposites with chemically modified graphene via in situ polymerization and …

Y Guo, G Xu, X Yang, K Ruan, T Ma, Q Zhang… - Journal of Materials …, 2018 - pubs.rsc.org
Both aminopropylisobutyl polyhedral oligomeric silsesquioxane (NH2-POSS) and hydrazine
monohydrate were utilized to functionalize graphene oxide (GO), and to obtain chemically …

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

X Yang, C Liang, T Ma, Y Guo, J Kong, J Gu… - … composites and hybrid …, 2018 - Springer
With the fast-developing miniaturization and integration of microelectronics packaging
materials, ultrahigh-voltage electrical devices, light-emitting diodes (LEDs), and in areas …

[HTML][HTML] Highly thermal conductive and electrical insulating polymer composites with boron nitride

M Li, M Wang, X Hou, Z Zhan, H Wang, H Fu… - Composites Part B …, 2020 - Elsevier
The heat accumulation has become a serious problem due to electronic devices towards
high power and intelligence. Highly thermal conductive and electrical insulating polymeric …

[HTML][HTML] Improved thermal conductivity and dielectric properties of hBN/PTFE composites via surface treatment by silane coupling agent

C Pan, K Kou, Q Jia, Y Zhang, G Wu, T Ji - Composites Part B: Engineering, 2017 - Elsevier
To achieve polymer-based composites for electronic packaging with low dielectric constant,
low dielectric loss tangent and high thermal conductivity, silane coupling agent KH550 …

3D printing of carbon black/polypropylene composites with excellent microwave absorption performance

L Lei, Z Yao, J Zhou, B Wei, H Fan - Composites Science and Technology, 2020 - Elsevier
Abstract 3D printing in virtue of strong designability has incomparable advantages in
material composition and structural design. In this work, carbon black/polypropylene …

Design and synthesis of polymer nanocomposites

EI Akpan, X Shen, B Wetzel, K Friedrich - Polymer composites with …, 2019 - Elsevier
Polymer nanocomposites are probably the most versatile materials today. They do not only
possess excellent properties but can also be made to exhibit combination of properties for …

[HTML][HTML] Synergistic improvement of thermal conductivities of polyphenylene sulfide composites filled with boron nitride hybrid fillers

J Gu, Y Guo, X Yang, C Liang, W Geng, L Tang… - Composites Part A …, 2017 - Elsevier
Hybrid fillers of micrometer boron nitride/nanometer boron nitride (mBN/nBN) were
employed to fabricate the highly thermally conductive insulating mBN/nBN/polyphenylene …