Prior work has demonstrated a new process utilizing room-temperature liquid metal,
Galinstan, as an interconnect material for flip-chip bonding. This interconnect forms a flexible …

In this paper, we report for the first time the design and fabrication of non-toxic liquid metal
(Galinstan) half-wavelength (¿ g/2) microstrip resonator. Patterning techniques of Galinstan …

Due to the mismatch of coefficient of thermal expansion (CTE) among different material
layers, power modules are usually under substantial thermomechanical stress during …

This paper describes the design and fabrication of liquid metal interconnects (vias) for 2.5 D
and 3D integration. The liquid metal is gallium indium eutectic (78.6% Ga, 21.4% In) with a …

In this paper, the application of liquid metals is demonstrated in adhesive bond handling for
micro-manipulation. Using the possibility to switch gallium between a liquid, low-adhesion …

Electrically reconfiguring communicational devices suffer from a number of drawbacks:
incorporating electrical elements such as varactors in unit cell level to manipulate the …

A new process utilizing room temperature liquid metals as interconnect material for flip chip
assembly of active circuits has been demonstrated. These interconnects form flexible bonds …

Flip chip interconnections have superior performance for microwave applications compared
to wire bond interconnections because of their reduced parasitics, more compact …