Achieving void-defect copper filling by electrodeposition on microvias is essentially
important. Rhodamine B (RhB) is of excellent suppressing ability based on electrochemical …

A novel chlorinated functional group-modified triphenylmethane derivative leveler BB1 is
used to achieve superconformal electrodeposition in microvias. Cyclic voltammetry (CV) and …

The methanesulfonate system is gradually replacing the traditional highly polluting fluoride
electroplating lead (Pb) system with its eco-friendly advantage, and searching for suitable …

In this study, the effects of poly (oxy-1, 2-ethanediyl), alpha-(4-nonylphenyl)-omega-hydroxy-
, branched (ANP) under various concentrations on the Cu-electrodeposition on the brass …

It is significantly important to develop novel suppressor to achieve cobalt superconformal
filling. Linear sweeping voltammetry (LSV) and impedance spectra (EIS) were coupled …

Functional silver coatings have been widely applied in fields of electrochemical energy
conversion systems, electronics industry and antibacterial materials, and exploiting new non …

A precise control of the microstructure of electrodeposited cobalt film is crucial for attaining
the desired and reproducible electrical performance in edge nanoelectronic devices. Here …

Achieving cobalt superconformal (bottom-up) growth is significantly important.
Electrochemical methods, including cyclic voltammetry, electrochemical impedance spectra …

Additives play a pivotal role in achieving high-quality electrodeposited cobalt films for
diverse applications in microelectronics. In this work, 1, 4-butynediol (BYD) bearing function …

Electrodeposition technology is the key core technology for achieving micro/nanoscale
interconnection in high-end chip manufacturing. Recently, cobalt interconnect structures …