Multi-Ports ([) 2×-Thru De-Embedding: Theory, Validation, and Mode Conversion Characterization

B Chen, J He, Y Guo, S Pan, X Ye… - IEEE Transactions on …, 2019 - ieeexplore.ieee.org
Because of the simplicity of design and measurement, as well as the accuracy of results, the
2×-thru de-embedding has replaced the traditional de-embedding algorithms such as thru …

Differential crosstalk mitigation in the pin field area of serdes channel with trace routing guidance

B Chen, S Pan, J Wang, S Yong… - IEEE Transactions on …, 2019 - ieeexplore.ieee.org
Crosstalk noise on the printed circuit board is usually decreased by adding shielding ground
(GND). In the trace routing area, the shielding vias are added to isolate the coupling …

A fully differential hybrid coupler for automotive radar applications

J Schoepfel, TT Braun, S Kueppers… - 2022 17th European …, 2022 - ieeexplore.ieee.org
In this paper, a fully differential hybrid coupler manufactured in a 130 nm SiGe technology is
proposed. The designed coupler offers a phase error below 3 o and an amplitude imbalance …

S-Parameter De-Embedding Error Estimation Based on the Statistical Circuit Models of Fixtures

Y Liu, S Yong, H Gao, S Hinaga… - IEEE Transactions …, 2020 - ieeexplore.ieee.org
S-parameter de-embedding methods require multiple fixtures to be identical. However, due
to manufacturing variations, the fixtures are never perfectly identical, which violates the …

A practical de-embedding error analysis method based on statistical circuit models of fixtures

S Yong, Y Liu, H Gao, S Hinaga, S De… - … , Signal & Power …, 2019 - ieeexplore.ieee.org
De-embedding methods require multiple identical fixtures. However, in reality the fixtures
cannot be fabricated perfectly identical due to manufacturing variations. The identical …

Extraction of stripline surface roughness using cross-section information and S-parameter measurements

Z Sun, J Liu, X Xiong, V Khilkevich… - … & Signal/Power …, 2022 - ieeexplore.ieee.org
To characterize additional conductor loss introduced by conductor surface roughness,
various models have been proposed to describe the relationship between foil roughness …

The simulated TDR impedance in PCB material characterization

Y Guo, DH Kim, J He, S Yong, Y Liu… - … Joint EMC/SI/PI and …, 2021 - ieeexplore.ieee.org
High-speed PCB design for signal integrity (SI) is about feasible material selection, trace
geometry determination and optimization of discontinuities, where the accurate PCB …

Causality analyzing for transmission line with surface roughness

X Sun, Y Guo, Y Sun, K Song, L Ye, X Ye… - … , Signal & Power …, 2019 - ieeexplore.ieee.org
Surface roughness of the conductor in transmission lines will introduce extra losses. The
recently proposed Huray model is quite accurate for modeling these additional losses by …

Far-end crosstalk control strategy for high-volume high-speed PCB manufacturing: The concept of critical resin content percent

Y Guo, S Yong, Y Liu, J He, B Pu, X Ye… - … Joint EMC/SI/PI and …, 2021 - ieeexplore.ieee.org
Far-end crosstalk (FEXT) can reduce the eye opening and eventually decrease the
maximum data rate that can be transmitted through the high-speed interconnections …

Study of TDR impedance for better analysis to measurement correlation

Y Guo, B Chen, X Sun, X Ye, J Hsu… - 2019 Joint International …, 2019 - ieeexplore.ieee.org
SI engineers usually build PCB test coupons and perform cross-sectioning and material
properties extraction, and then do design optimization. But designing transmission lines on …