Background: In recent years, electronic textiles (e-textiles) have attracted widespread
attention due to their versatility, but still lack a good packaging technique. Soldering, one of …

With the miniaturization of electronic components and higher density of electrical
connections in the printed circuit boards, the properties of conventional solder masks are …

The reliability of flip-chip packages is significantly impacted by the type of packaging
materials, such as underfill, solder, flux, and solder mask. Underfill reduces the coefficient of …

To enhance the solderability, highly active fluxes are commonly employed in lead-free
soldering. However, there are industry-wide efforts to use less active fluxes to avoid possible …

Micro-transfer printing (μTP) has been widely used to integrate photonic components, such
as lasers, modulators, photodetectors, micro-LEDs, on Si photonic platforms. There is a push …

Approaches such as the modification of substrate design and the use of different types of
underfill/epoxy mold compound were proposed to solve the delamination problem in system …

Purpose Reflow solder joint quality is significantly affected by the ability of the solder to
perfectly fill pad space and retain good solder joint shape. This study aims to investigate …

In the reflow process, the thermal decomposition of flux with different thermal stability will
lead to different residues on printed circuit board assemblies, which will affect the reliability …

Flux is essential in the soldering process. Regardless of the solder materials, soldering
process types, and classifications, fluxes are essential for determining solder joints' reliability …

Due to electronics miniaturization, the size of voids is becoming comparable to that of solder
joints, thereby increasing the risk of reduced reliability. This work presents a novel method of …