Plating on acrylonitrile–butadiene–styrene (ABS) plastic: a review
S Olivera, HB Muralidhara, K Venkatesh… - Journal of materials …, 2016 - Springer
ABS is an engineering plastic that has butadiene part uniformly distributed over the
acrylonitrile-styrene matrix. It possesses excellent toughness, good dimensional stability …
acrylonitrile-styrene matrix. It possesses excellent toughness, good dimensional stability …
Removal of p-nitrophenol (PNP) in aqueous solution by the micron-scale iron–copper (Fe/Cu) bimetallic particles
B Lai, Y Zhang, Z Chen, P Yang, Y Zhou… - Applied Catalysis B …, 2014 - Elsevier
In this study, in order to further investigate the degradation capacity and mechanism of
Fe/Cu bimetallic system, the prepared Fe/Cu bimetallic particles with different theoretical …
Fe/Cu bimetallic system, the prepared Fe/Cu bimetallic particles with different theoretical …
3D-MID technology for surface modification of polymer-based composites: a comprehensive review
The three-dimensional molded interconnected device (3D-MID) has received considerable
attention because of the growing demand for greater functionality and miniaturization of …
attention because of the growing demand for greater functionality and miniaturization of …
One-step electrodeposition of copper on conductive 3D printed objects
Abstract 3D printing with electrically conductive filaments enables rapid prototyping and
fabrication of electronics, but the performance of such devices can be limited by the fact that …
fabrication of electronics, but the performance of such devices can be limited by the fact that …
Ultra-flexible stretchable liquid metal circuits with antimicrobial properties through selective laser activation for health monitoring
S Li, H Zhao, H Xu, H Lu, P Luo, T Zhou - Chemical Engineering Journal, 2024 - Elsevier
Liquid metal (LM) was generally used to construct flexible wearable electronics to solve the
stretchability-conductivity dilemma of traditional electronic devices. Herein, ultra-flexible and …
stretchability-conductivity dilemma of traditional electronic devices. Herein, ultra-flexible and …
Fabrication of flexible copper-based electronics with high-resolution and high-conductivity on paper via inkjet printing
T Zhang, X Wang, T Li, Q Guo, J Yang - Journal of Materials Chemistry …, 2014 - pubs.rsc.org
Flexible and printable electronics are attractive techniques which have potential for broad
applications not only in flexible but also in large area electronics. An effective and …
applications not only in flexible but also in large area electronics. An effective and …
Effective removal of coordinated copper from wastewater using a new dithiocarbamate-type supramolecular heavy metal precipitant
A new dithiocarbamate-type heavy metal precipitant, sodium 1, 3, 5-
hexahydrotriazinedithiocarbamate (HTDC), was prepared and used to remove coordinated …
hexahydrotriazinedithiocarbamate (HTDC), was prepared and used to remove coordinated …
Preparation of a new capsule phase change material for high temperature thermal energy storage
Q Li, X Ma, X Zhang, J Zhang, J Ma, X Hu… - Journal of Alloys and …, 2021 - Elsevier
Phase change materials (PCMs) have the function of the high temperature thermal energy
storage through the phase transition of Al alloys. The liquid alloys have certain liquidity and …
storage through the phase transition of Al alloys. The liquid alloys have certain liquidity and …
Preparation of Cu-graphene coating via electroless plating for high mechanical property and corrosive resistance
S Li, G Song, Q Fu, C Pan - Journal of Alloys and Compounds, 2019 - Elsevier
In this paper, the copper (Cu)-graphene (Gr) composite coating was prepared successfully
by using electroless plating with copper sulfate (CuSO 4) as the main salt and sodium …
by using electroless plating with copper sulfate (CuSO 4) as the main salt and sodium …
Microencapsulation of Al-Zn alloy as phase change materials for high-temperature thermal storage application
Q Li, X Ma, X Zhang, J Ma, X Hu, Y Lan - Materials Letters, 2022 - Elsevier
Abstract Microencapsulation of Al-Zn alloy as novel phase change materials was proposed.
The three-step process of microencapsulated PCMs (MEPCMs) was proposed in this work …
The three-step process of microencapsulated PCMs (MEPCMs) was proposed in this work …