For the past couple of decades, a considerable amount of time and effort has been spent to
enhance the predictability of warpage of semiconductor packages encapsulated by epoxy …

Cure shrinkage of the epoxy molding compound (EMC) for semiconductor package during
molding process, was precisely measured using a fiber Bragg grating (FBG) sensor by …

Curing shrinkage of adhesives in the bonding process usually leads to deformation and
residual stresses. The measurement of curing shrinkage is valuable in providing …

Semiconductor packaging continues to reduce in thickness following the overall thinning of
electronic devices such as smartphones and tablets. As the package becomes thinner, the …

Among the strategies to produce healable thermosetting systems is their modification by the
addition of thermoplastic particles. This work investigates the influence of poly (ethylene-co …

In this study, a new approach using optical fiber sensor based on a single fiber Bragg
grating (FBG) is proposed to overcome the cost and complexity limitations. The reflected …

This article investigated the structure and packaging features of Bi–B–Zn sealing glass with
Bi 2 O 3 concentrations ranging from 38 to 63 (wt%). The results indicate that when Bi 2 O 3 …

Adhesive bonding is widely used in the assembly of high-precision optomechanical
products. However, of the curing and relaxation behaviors as well as environmentally …

Advanced prepreg (PPG) contains a low CTE glass fabric that is impregnated with resin
filled with fillers. A typical volume fraction of the glass fabric in advanced PPG is relatively …

Composite bonded structures are widely used in the field of aerospace. The safety of
composite structures can be ensured by the health monitoring and early warning of their …