Integrated circuit chips and chip packages are disclosed that include an over-passivation
scheme at a top of the integrated circuit chip and a bottom scheme at a bottom of the …

(60) Provisional application No. 60/462,170, filed on Apr. as a lead frame incorporating a
large thermally-conductive 11, 2003, provisional application No. 60/449,673, plate and …

Various embodiments of fanout packages are disclosed. A method of forming a
microelectronic assembly is disclosed. The method can include bonding a first surface of at …

US10515981B2 - Multilevel semiconductor device and structure with memory - Google
Patents US10515981B2 - Multilevel semiconductor device and structure with memory …

Stackable circuit structures and methods of fabrication are provided employing first level
metallization directly on a chips-first layer (s), which includes: a chip (s), each with a pad …

(63) Contmuatlon-m-part of appl1cat1on No. 10/210,160, Krumholz & Memlik, LLp? led on
Aug. 1, 2002, noW Pat. No. 6,856,007, and a continuation-in-part of application No …

US9219005B2 - Semiconductor system and device - Google Patents US9219005B2 -
Semiconductor system and device - Google Patents Semiconductor system and device …

US9099526B2 - Integrated circuit device and structure - Google Patents US9099526B2 -
Integrated circuit device and structure - Google Patents Integrated circuit device and structure …

Packaged microelectronic elements are provided. In an exem plary embodiment, a
microelectronic element having a front face and a plurality of peripheral edges bounding the …

H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state
components formed in or on a common substrate including semiconductor components …