Photonics die or integrated photonics modules co-packaged with compute engines have the
potential to deliver significant improvements in power, bandwidth and reach needed to meet …

Sensors link the physical and electronic worlds, finding uses in environmental, automotive,
industrial, communication, and medical applications, among many more. Here, current …

A flip-chip co-packaged linear transimpedance amplifier (TIA) in 16-nm fin field effect
transistor (FinFET) CMOS demonstrating 112-Gb/s four-level pulse-amplitude modulation (4 …

Optical receivers (ORXs) with integrated CMOS electronics enable compact, low-power
solutions for 400-G Ethernet and co-packaged optics. In this article, we present a 100-Gb/s …

We review the design trade-offs that exist in CMOS inverter-based shunt-feedback
transimpedance amplifier (SF-TIA) when optimizing for energy efficiency. We analyze the …

High spectral efficiency offered by the coherent optical communication links makes them
attractive for the nextgeneration optical communication links. Using advanced modulation …

High-speed, low-power optical interconnects, such as intensity modulation direct detection
(IMDD) optical links, are increasingly deployed in data centers to keep pace with the …

A linear-array receiver analog front-end (AFE) circuit, which mainly consists of 16
transimpedance amplifiers (TIAs), is presented for pulsed time-of-flight (TOF) rotating …

This article presents two dual-photodiode (PD) differential optical receivers that achieve
double photodetection area to support gigabit-per-second optical wireless communication …

Noise probably the single most important performance metric of the high-speed
transimpedance amplifier (TIA), which directly sets the sensitivity of optical receiver. The …