Many of the new organic–inorganic hybrid materials for next generation optoelectronics
have organic components sensitive to oxygen, moisture, and temperature, requiring …

There have been reports about electric-field-assisted diffusion bonding of electrolyte
materials, but how dielectric materials behave in such process hasn't been seen in literature …

This paper presents the fabrication and characterization of a resonant pressure microsensor
based on SOI-glass wafer-level vacuum packaging. The SOI-based pressure microsensor …

The morphologies and structural details of formed silica at the interface of silicon-glass
anodic bonding determine the stress at the interface but they have been rarely clarified. In …

Abstract Glass-Al-glass with Al as common anode was successfully bonded together
through the anodic bonding process. SEM and EDS were conducted to investigate the …

Unstable cutting conditions limit the profitability in milling. While analytical and numerical
approaches for estimating the limiting axial depth of cut as a function of spindle speed are …

This paper is devoted to discussing the influence of thermal stress on the performance of the
Butterfly Vibratory Gyroscope (BFVG). In many gyroscopes, due to the material properties …

In order to achieve and maintain a high quality factor (high-Q) for the micro resonant
pressure sensor, this paper presents a new wafer level package by adopting cross-layer …

This paper presents a silicon-glass-silicon triple stacked structure for fabrication of
micromachined silicon resonator accelerometer. The triple stacked structure was achieved …

Silicon/glass anodic bonding is widely investigated during MEMS packaging of multi-stack
structures. The electrical behavior of anode bonding can be described as the charging and …