A Novel LTCC-based 3D Packaging for Ultrawideband RF Applications
J Zhang, D Dong, J Liu, H Lai - 2019 International Conference …, 2019 - ieeexplore.ieee.org
This paper realized high-density stereo packaging based on LTCC by researching the 3D
integration method of integrated devices in double-sided cavities on an independent LTCC …
integration method of integrated devices in double-sided cavities on an independent LTCC …
3D Transitions and Connections
R Sturdivant - RF and Microwave Microelectronics Packaging II, 2017 - Springer
In this chapter, we will consider four types of 3D transitions. Each transition type has its own
challenges, but each follows the design principles of keeping the transition as compact as …
challenges, but each follows the design principles of keeping the transition as compact as …
[PDF][PDF] 3D Heterogeneous Integration Of Microwave/Millimeter-Wave Sensor And Communications Microsystems Using High-Aspect Ratio Micromachined" Building …
S Raman - 2013 - apps.dtic.mil
Prior work has demonstrated a new process utilizing room-temperature liquid metal,
Galinstan, as an interconnect material for flip-chip bonding. This interconnect forms a flexible …
Galinstan, as an interconnect material for flip-chip bonding. This interconnect forms a flexible …