This paper introduces a novel approach to address thermal management challenges in
system-in-package (SiP) technology, which is a significant concern in various advanced …

Accurate thermal analysis is essential for the design of reliable of system-in-package (SiP).
This paper proposes a transient thermal analysis of the SiP technology based on four chips …

We present in this paper design considerations and implementation challenges of a
proposed versatile SoC/SiP sensor interface intended for industrial applications. The …

Since accurate thermal analysis is essential for the design and thermal management of
System-in-Package (SiP). This paper proposes a transient thermal analysis of the System-in …

We present in this paper a new modified version of the System-in-Package (SiP) model
based on three-layer chips. The idea is to add copper layers permitting to take up its thermal …

This paper evaluates the thermal and thermo-mechanical behavior of a packaged sensor
interface embedding several high and low-voltage integrated circuits (ICs). The main …

In this paper, we propose a thermal profile based on the finite element method (FEM). The
proposed model is used to predict the temperature profile of the Xilinx™ SPARTAN-3E Field …

The reliability and lifetime of systems-on-chip (SoCs) are being seriously threatened by
thermal issues. In modern SoCs, dynamic thermal management (DTM) uses the thermal …

It is well known that Field Programmable Gate Arrays (FPGA) are good platforms for
implementing embedded systems because of their configurable nature. However, the …

To control the laser machining process of cooling holes on thermal barrier coatings (TBCs)
deposited on turbine blades, we implemented interface detection in the depth direction by …