In traditional approach of silicon optical lens production, grinding, lapping, and polishing are
employed. Success of these steps depends on the quality of the preceding ones; therefore …

Atomistic-based multiscale and molecular dynamics modeling are powerful tools to simulate
the localized strain problems, offering tremendous opportunities to bridge the knowledge …

Laser assisted diamond turning is a potential approach to increase the surface finish quality
on the hard and brittle materials and to improve diamond tool life. A high effective laser …

Molecular dynamics (MD) simulation was employed in this study to elucidate the dislocation/
amorphization-based plasticity mechanisms in single crystal 3C–SiC during nanometric …

In recent years, elliptical vibration cutting (EVC) has become a promising technique to
fabricate high quality surface of single-crystal silicon. However, our understanding for its …

Achieving nanometric surface on single-crystal silicon is important for semiconductor and
optoelectronics industries. In recent years, thermal assisted machining (hot machining) …

Coupling of multiple abrasive grains is crucial for the efficiency in the grinding process and
grinder design. Here the coupling effect in a double-grain model in vibration-assisted …

Silicon wafer thinning is mostly performed by the method of self-rotating grinding. In
grinding, the grinding force is a crucial factor of affecting the grinding performance, form …

The ultra-precision grinding technology based on a workpiece self-rotational principle is
extensively used for silicon wafer thinning in the chip post-processing. Nevertheless, owing …

In this paper, molecular dynamics simulations are carried out to investigate the cutting
mechanism during the hybrid machining process combined the thermal and vibration …