Overview of different approaches in numerical modelling of reflow soldering applications
This paper gives a review of different applications in the numerical modelling of reflow
soldering technology from recent years. The focus was on detailing the different process …
soldering technology from recent years. The focus was on detailing the different process …
Reflow recipe establishment based on CFD-Informed machine learning model
This article proposes a computational fluid dynamics (CFD)-based machine learning (ML)
model to set the temperature of a convection reflow oven and control conveyor speed. Due …
model to set the temperature of a convection reflow oven and control conveyor speed. Due …
Effect of differently shaped solder joints of chip resistor on fatigue life
As surface mount components shrink in size, smaller apertures on stencils during solder
paste printing can lead to uneven solder volume on a single resistor. This can result in the …
paste printing can lead to uneven solder volume on a single resistor. This can result in the …
Smarter temperature setup for reflow oven to minimize temperature variation among components
The thermomechanical reliability of surface mount components (SMCs) is closely related to
the reflow soldering process. With the rise of board complexity, an optimal reflow profile must …
the reflow soldering process. With the rise of board complexity, an optimal reflow profile must …
Shape dependency of fatigue life in solder joints of chip resistors
This study is attempted to correlate between solder joint shape and fatigue life in
experimental and numerical approaches. The test assemblies consisting of R1005 (1.0× 0.5 …
experimental and numerical approaches. The test assemblies consisting of R1005 (1.0× 0.5 …
In situ monitoring of flip chip package process using thermal resistance network method and active thermography
Flip chip technology has been used extensively in microelectronic packaging due to the high
density, fine spacing, smaller size. However, the size and spacing of the solder bumps are …
density, fine spacing, smaller size. However, the size and spacing of the solder bumps are …
A deep learning approach for reflow profile prediction
Commercial reflow ovens contain multiple heated zones, which can be individually
controlled for temperature. PCB assemblies travel through each zone at a controlled rate to …
controlled for temperature. PCB assemblies travel through each zone at a controlled rate to …
The optimal solution of reflow oven recipe based on physics-guided machine learning model
This paper presents a physics-guided machine learning model to provide the optimal reflow
recipe for a 7-zone oven. The numerical method based on the computational fluid dynamics …
recipe for a 7-zone oven. The numerical method based on the computational fluid dynamics …
Reflow profiling with the aid of machine learning models
Purpose This paper aims to propose a method to quickly set the heating zone temperatures
and conveyor speed of the reflow oven. This novel approach intensely eases the trial and …
and conveyor speed of the reflow oven. This novel approach intensely eases the trial and …
A comparative study of the thermomechanical reliability of fully-filled and conformal through-glass via
This study investigates the thermomechanical response of the copper TGV during thermal
cycling. Two different geometries of copper TGV, the fully-filled TGV and conformal TGV, are …
cycling. Two different geometries of copper TGV, the fully-filled TGV and conformal TGV, are …