Overview of different approaches in numerical modelling of reflow soldering applications

I Bozsóki, A Géczy, B Illés - Energies, 2023 - mdpi.com
This paper gives a review of different applications in the numerical modelling of reflow
soldering technology from recent years. The focus was on detailing the different process …

Reflow recipe establishment based on CFD-Informed machine learning model

Y Lai, JH Ha, KA Deo, J Yang, P Yin… - IEEE Transactions on …, 2023 - ieeexplore.ieee.org
This article proposes a computational fluid dynamics (CFD)-based machine learning (ML)
model to set the temperature of a convection reflow oven and control conveyor speed. Due …

Effect of differently shaped solder joints of chip resistor on fatigue life

J Ha, Y Lai, J Yang, P Yin… - Journal of …, 2024 - asmedigitalcollection.asme.org
As surface mount components shrink in size, smaller apertures on stencils during solder
paste printing can lead to uneven solder volume on a single resistor. This can result in the …

Smarter temperature setup for reflow oven to minimize temperature variation among components

Y Lai, K Pan, C Cai, P Yin, J Yang… - IEEE Transactions on …, 2022 - ieeexplore.ieee.org
The thermomechanical reliability of surface mount components (SMCs) is closely related to
the reflow soldering process. With the rise of board complexity, an optimal reflow profile must …

Shape dependency of fatigue life in solder joints of chip resistors

J Ha, C Cai, P Yin, Y Lai, K Pan… - 2022 IEEE 72nd …, 2022 - ieeexplore.ieee.org
This study is attempted to correlate between solder joint shape and fatigue life in
experimental and numerical approaches. The test assemblies consisting of R1005 (1.0× 0.5 …

In situ monitoring of flip chip package process using thermal resistance network method and active thermography

B Zhou, J Qiao, Y Su, W Huang, L Li - … Journal of Heat and Mass Transfer, 2024 - Elsevier
Flip chip technology has been used extensively in microelectronic packaging due to the high
density, fine spacing, smaller size. However, the size and spacing of the solder bumps are …

A deep learning approach for reflow profile prediction

Y Lai, J Kataoka, K Pan, J Ha, J Yang… - 2022 IEEE 72nd …, 2022 - ieeexplore.ieee.org
Commercial reflow ovens contain multiple heated zones, which can be individually
controlled for temperature. PCB assemblies travel through each zone at a controlled rate to …

The optimal solution of reflow oven recipe based on physics-guided machine learning model

Y Lai, K Pan, J Ha, C Cai, J Yang, P Yin… - 2022 21st IEEE …, 2022 - ieeexplore.ieee.org
This paper presents a physics-guided machine learning model to provide the optimal reflow
recipe for a 7-zone oven. The numerical method based on the computational fluid dynamics …

Reflow profiling with the aid of machine learning models

Y Lai, S Park - Soldering & Surface Mount Technology, 2023 - emerald.com
Purpose This paper aims to propose a method to quickly set the heating zone temperatures
and conveyor speed of the reflow oven. This novel approach intensely eases the trial and …

A comparative study of the thermomechanical reliability of fully-filled and conformal through-glass via

K Pan, C Okoro, Y Lai, D Joshi, S Park… - 2022 IEEE 72nd …, 2022 - ieeexplore.ieee.org
This study investigates the thermomechanical response of the copper TGV during thermal
cycling. Two different geometries of copper TGV, the fully-filled TGV and conformal TGV, are …