The metal–oxide–semiconductor field-effect transistor (MOSFET), a core element of
complementary metal–oxide–semiconductor (CMOS) technology, represents one of the …

The 2-D semiconductors have been recognized as promising channel materials for the
ultimately scaled transistor technologies beyond silicon. An essential technology enabler for …

The world's appetite for analyzing massive amounts of structured and unstructured data has
grown dramatically. The computational demands of these abundant-data applications, such …

Monolithic 3D integration technology has emerged as an alternative candidate to
conventional transistor scaling. Unlike conventional processes where multiple metal layers …

As physical transistor scaling nears its fundamental limits and many applications are
increasingly bottlenecked by memory bandwidth, three-dimensional (3D) integration is a …

Heat spreading is critical in reducing the overall junction temperature of monolithic system-
on-chips (SoCs) and high-heat-flux radio frequency (RF) applications. Bulk diamond has the …

In this paper, we present a comprehensive study of the unique thermal behavior in
monolithic 3D ICs. In particular, we study the impact of the thin inter-layer dielectric (ILD) …

This paper summarizes the thermal challenges in conventional 3-D stacks and proposes a
novel stacking structure that eases the thermal problem. The objective of this paper is first to …

Monolithic 3D (Mono3D) is a three-dimensional integration technology that can overcome
some of the fundamental limitations faced by traditional, two-dimensional scaling. This paper …

Monolithic 3-D (MONO3 D) integration provides performance and power efficiency benefits
over 2-D circuits and, thus, is a potent technology for the design of deep neural network …