The goal of creep fatigue modelling is the compounding of the damage caused by creep and
fatigue mechanisms. The different approaches for compounding these damage mechanisms …

The reliability of electronics under drop-shock conditions has attracted significant interest in
recent years due to the widespread use of mobile electronic products. This review focuses …

Electronics subjected to shock and vibration may experience strain rates of 1-100 sec-1.
High strain rate data is scarce for leadfree solders at strain rates in the range of 1-100 sec-1 …

Based on the unified creep and plasticity theory, an improved constitutive model is proposed
in this study to describe the uniaxial mechanical behaviour of Sn3. 0Ag0. 5Cu (SAC305) …

As resistance to drop impact is a standardized evaluation for consumer electronics, the
dynamic behaviour of solder material is critical to ensure the prediction accuracy about …

Electronic devices are increasingly portable, and often susceptible to damage during
handling, transportation, and service. Because of the great variety of stresses to which …

The sequential thermal cycling (TC) and drop impact test are more reasonable to evaluate
the reliability of lead-free solder interconnections compared with separate TC test or drop …

" Constrained Deformation of Materials: Devices, Heterogeneous Structures and Thermo-
Mechanical Modeling" is an in-depth look at the mechanical analyses and modeling of …

In this paper, dynamic fracture of a single solder joint specimen is numerically simulated
using the finite element method. The solder-IMC and IMC-Cu pad interfaces are modeled as …

As traditional lead-based solders are banned and replaced by lead-free solders, the drop
impact reliability is becoming increasingly crucial because there is little understanding of …